SCHEMBL544788

SCHEMBL544788

O=C(O)C1=CC=CC(F)(C(=O)O)C1

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.35
MAPK1 P28482 1/20 0.35
HSD17B10 Q99714 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
THRB P10828 1/20 0.34
BLM P54132 1/20 0.34
PMP22 Q01453 1/20 0.34
KMT2A Q03164 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4124190 0.77 TSHR (0.35) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL8210522 0.76 TSHR (0.37) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL3869556 0.76 TSHR (0.34) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL466286 0.74 TSHR (0.36) TSHRMAPK1HSD17B10TDP1THRB
Fluoromethane SCHEMBL28203674 0.74 TSHR (0.33) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL3961385 0.74 TSHR (0.38) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL27420794 0.73 TSHR (0.35) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL1982478 0.73 TSHR (0.39) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL1236079 0.73 TSHR (0.35) TSHRMAPK1HSD17B10TDP1THRB
SCHEMBL27361330 0.73 TSHR (0.35) TSHRMAPK1HSD17B10TDP1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6960420-B2 Photosensitive resin composition, process for forming relief pattern, and electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2005-11-01 US claimed
US-20040142275-A1 Photosensitive resin composition, process for forming relief pattern, and electronic component HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2004-07-22 US claimed
US-20240319624-A1 RESIN PARTICLES, TONER, METHOD FOR MANUFACTURING RESIN PARTICLES, IMAGE FORMING APPARATUS, AND METHOD OF FORMING IMAGE RICOH COMPANY, LTD. (JP) 2024-09-26 US disclosed
EP-4174108-B1 RESIN PARTICLE, TONER, DEVELOPER, DEVELOPER STORAGE CONTAINER, RESIN PARTICLE PRODUCING METHOD, TONER PRODUCING METHOD, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD RICOH CO LTD (JP) 2024-09-18 EP disclosed
US-20240228770-A1 RESIN PARTICLES, METHOD FOR PRODUCING RESIN PARTICLES, TONER, DEVELOPER, TONER STORAGE, AND IMAGE FORMING APPARATUS RICOH COMPANY, LTD. (JP) 2024-07-11 US disclosed
US-20230324823-A1 RESIN PARTICLES, TONER, DEVELOPER, TONER HOUSING UNIT, IMAGE FORMING APPARATUS, AND METHOD OF FORMING IMAGE RICOH COMPANY, LTD. (JP) 2023-10-12 US disclosed
US-20230139673-A1 RESIN PARTICLE, TONER, DEVELOPER, DEVELOPER STORAGE CONTAINER, RESIN PARTICLE PRODUCING METHOD, TONER PRODUCING METHOD, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD RICOH COMPANY, LTD. (JP) 2023-05-04 US disclosed
EP-4174108-A1 RESIN PARTICLE, TONER, DEVELOPER, DEVELOPER STORAGE CONTAINER, RESIN PARTICLE PRODUCING METHOD, TONER PRODUCING METHOD, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD Ricoh Company, Ltd. (JP) 2023-05-03 EP disclosed
EP-3418811-B1 TONER, DEVELOPER, PROCESS CARTRIDGE, IMAGE FORMING APPARATUS, IMAGE FORMING METHOD, AND METHOD FOR MANUFACTURING TONER RICOH CO LTD (JP) 2021-07-28 EP disclosed
US-11021572-B2 Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component HD MICROSYSTEMS, LTD. (JP) 2021-06-01 US disclosed
CN-106575095-B image forming apparatus with a toner supply unit 株式会社理光 2019-12-13 CN disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-6380271-B1 MIXING A POLYBENZOXAZOLE PRECURSOR OR A POLYBENZOXAZOLE RESIN WITH AN OLIGOMER, FORMING FILM FROM RESULTING MIXTURE, HEATING FILM IN NITROGEN CONTAINING OXYGEN TO GIVE RISE TO THERMAL DECOMPOSITION AND GASIFICATION OF OLIGOMER TO FORM RESIN LAYER SUMITOMO BAKELITE COMPANY LIMITED (JP) 2002-04-30 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed
US-6297351-B1 EXCELLENT IN ELECTRIC CHARACTERISTICS AND HEAT RESISTANCE, PRECURSOR FROM A DICARBOXYLIC ACID AND A BISAMINOPHENOL COMPOUND OR A DIAMINODIHYDROXY SUMITOMO BAKELITE COMPANY LIMITED (JP) 2001-10-02 US disclosed
US-6114497-A POLYBENOXAZOLE PRECURSOR HAVING RECURRING UNIT OF AROMATIC DICARBOXYLIC ACID AND 2,2'-BIS(3-AMINO-4-HYDROXY-5 OR 6-FLUOROALKYLSUBSTITUTED PHENYL)-TRIFLUOROMETHYLPHENYL)HEXAFLUOROPROPANE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-09-05 US disclosed
JP-2000128984-A POLYBENZOXAZOLE PRECURSOR AND RESIN SUMITOMO BAKELITE CO LTD 2000-05-09 JP disclosed
EP-0997488-A1 Polybenzoxazole resin and precursor thereof SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-05-03 EP disclosed