⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL545794 | 0.71 | LMNA (0.30) | — | |
| SCHEMBL972471 | 0.67 | — | — | |
| SCHEMBL22200158 | 0.65 | — | — | |
| SCHEMBL545225 | 0.62 | — | — | |
| SCHEMBL31347640 | 0.62 | — | — | |
| SCHEMBL22734006 | 0.62 | — | — | |
| SCHEMBL6046989 | 0.62 | — | — | |
| SCHEMBL4543014 | 0.60 | — | — | |
| SCHEMBL1428307 | 0.60 | — | — | |
| SCHEMBL1927648 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | disclosed |
| US-20240213088-A1 | SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES | APPLIED MATERIALS, INC. | 2024-06-27 | — | — | US | disclosed |
| US-11990368-B2 | Doped selective metal caps to improve copper electromigration with ruthenium liner | APPLIED MATERIALS, INC. (US) | 2024-05-21 | — | — | US | disclosed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | disclosed |
| US-11923244-B2 | Subtractive metals and subtractive metal semiconductor structures | APPLIED MATERIALS, INC. (US) | 2024-03-05 | — | — | US | disclosed |
| US-11875987-B2 | Contacts having a geometry to reduce resistance | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2024-01-16 | — | — | US | disclosed |
| US-11384429-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2022-07-12 | — | — | US | disclosed |
| US-11373903-B2 | Doped selective metal caps to improve copper electromigration with ruthenium liner | APPLIED MATERIALS, INC. (US) | 2022-06-28 | — | — | US | disclosed |
| US-11062993-B2 | Contacts having a geometry to reduce resistance | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2021-07-13 | — | — | US | disclosed |
| US-20200194371-A1 | CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2020-06-18 | — | — | US | disclosed |
| WO-2010025068-A2 | COBALT DEPOSITION ON BARRIER SURFACES | APPLIED MATERIALS, INC. (US) | 2010-03-04 | — | — | WO | disclosed |
| WO-2009134840-A2 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | disclosed |
| WO-2009134916-A2 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | disclosed |
| WO-2009134925-A2 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | disclosed |
| US-20090269507-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2009-10-29 | — | — | US | disclosed |
| US-20090053426-A1 | COBALT DEPOSITION ON BARRIER SURFACES | APPLIED MATERIALS, INC. | 2009-02-26 | — | — | US | disclosed |
| US-20090004850-A1 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS | APPLIED MATERIALS, INC. | 2009-01-01 | — | — | US | disclosed |
| US-20080268635-A1 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. | 2008-10-30 | — | — | US | disclosed |
| WO-2007121249-A2 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | disclosed |
| US-20070202254-A1 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. | 2007-08-30 | — | — | US | disclosed |