⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5450453 | 0.89 | — | — | |
| SCHEMBL16243460 | 0.84 | — | — | |
| SCHEMBL425781 | 0.83 | ALDH1A1 (0.32) | — | |
| SCHEMBL8440727 | 0.79 | TDP1 (0.34) | — | |
| SCHEMBL11292064 | 0.78 | — | — | |
| SCHEMBL9128476 | 0.76 | — | — | |
| SCHEMBL52046 | 0.75 | GABRA1 (0.33) | — | |
| SCHEMBL9160477 | 0.75 | MAOA (0.39) | — | |
| SCHEMBL36333 | 0.75 | MAOA (0.39) | — | |
| SCHEMBL10476775 | 0.75 | MAOA (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1327 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122080620-A | Low-shrinkage photo-curing elastic resin composition based on synergistic compensation and application thereof | — | 2026-05-26 | — | — | CN | claimed |
| CN-119264336-A | Polybutadiene acrylate photosensitive resin composition with self-healing property and application thereof in 405nm photocuring 3D printing | 福建农林大学 | 2025-01-07 | — | — | CN | claimed |
| CN-118931467-A | High-adhesive-strength and high-water-resistance UV (ultraviolet) glue and preparation method thereof | 河源然生新材料有限公司 | 2024-11-12 | — | — | CN | claimed |
| CN-118459686-A | Photosensitive resin composition based on polybutadiene polyurethane acrylate and application of photosensitive resin composition in 405nm photocuring 3D printing | 泉州师范学院 | 2024-08-09 | — | — | CN | claimed |
| CN-118192169-A | Photo-thermal curing 3D printing photosensitive resin composition and printing method thereof at 405nm | 杭州喜马拉雅信息科技有限公司 | 2024-06-14 | — | — | CN | claimed |
| CN-117866149-A | Photosensitive resin composition based on ionic liquid and application of photosensitive resin composition in 405nm3D printing | 福州大学 | 2024-04-12 | — | — | CN | claimed |
| CN-117844234-A | Resin composition based on PSS-PEDOT waterborne polyurethane acrylate and application thereof | 泉州师范学院 | 2024-04-09 | — | — | CN | claimed |
| CN-115197375-B | Photosensitive resin composition suitable for 3D printing transparent elastomer and preparation method thereof | 材翼新材料科技(苏州)有限公司 | 2024-04-02 | — | — | CN | claimed |
| CN-117720687-A | Repairable polyurethane photosensitive resin composition and application thereof in 405nm photocuring 3D printing | 泉州师范学院 | 2024-03-19 | — | — | CN | claimed |
| CN-117586621-A | Silicon chain-containing acrylic liquid crystal photosensitive resin composition and application thereof in 3D printing | 泉州师范学院 | 2024-02-23 | — | — | CN | claimed |
| CN-109836537-A | A kind of application based on anacardol photosensitive resin composition and its in 405nm 3D printing | 泉州师范学院 | 2019-06-04 | — | — | CN | claimed |
| CN-104830159-A | Preparation method and application of photo-curing color paste containing graphene | UNIV QINGDAO SCIENCE & TECHNOLOGY | 2015-08-12 | — | — | CN | claimed |
| CN-104817835-A | Photosensitive resin composition and application thereof in three-dimensional printing | FUJIAN MATTER STRUCTURE | 2015-08-05 | — | — | CN | claimed |
| CN-104765251-A | High-toughness photosensitive resin for 3D printing and preparation method thereof. | UNIV QINGDAO SCIENCE & TECHNOLOGY | 2015-07-08 | — | — | CN | claimed |
| US-8003292-B2 | Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer | INFINEON TECHNOLOGIES AG (DE) | 2011-08-23 | — | — | US | claimed |
| US-5637395-A | PHOTOCURABLE RUBBER OR ACRYL-BASED PRESSURE SENSITIVE ADHESIVE; THREE DIMENSIONAL NETWORK | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1997-06-10 | — | — | US | claimed |
| EP-0368327-B1 | Light-sensitive composition | FUJI PHOTO FILM CO LTD (JP) | 1995-02-15 | — | — | EP | claimed |
| EP-0157508-B1 | THIN ADHESIVE SHEET FOR USE IN WORKING SEMICONDUCTOR WAFERS | NITTO DENKO CORPORATION (JP) | 1992-07-15 | — | — | EP | claimed |
| EP-0368327-A2 | Light-sensitive composition | FUJI PHOTO FILM CO., LTD. (JP) | 1990-05-16 | — | — | EP | claimed |
| EP-0157508-A2 | Thin adhesive sheet for use in working semiconductor wafers | NITTO DENKO CORPORATION (JP) | 1985-10-09 | — | — | EP | claimed |