SCHEMBL5482340

SCHEMBL5482340

C=C(C)C(=O)OOCOc1ccc(C(C)(C)c2ccc(OCC)cc2)cc1

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 2/20 0.40
EPHX2 P34913 1/20 0.40
NR1H4 Q96RI1 1/20 0.40
NPC1 O15118 1/20 0.40
AR P10275 1/20 0.39
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
PLK1 P53350 1/20 0.39
LMNA P02545 1/20 0.39
CYP1A2 P05177 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
PARP10 Q53GL7 1/20 0.38
KDM4E B2RXH2 5/20 0.38
POLB P06746 1/20 0.38
ALDH1A1 P00352 6/20 0.37
MAPT P10636 2/20 0.37
SMN1; SMN2 Q16637 2/20 0.37
HTT P42858 1/20 0.37
NQO1 P15559 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5228296 0.86 AR (0.43) RAB9AEPHX2NR1H4NPC1AR
SCHEMBL1280197 0.80 POLB (0.47) RAB9ANPC1ARMEN1KMT2A
SCHEMBL6293936 0.78 HTT (0.54) ARMEN1KMT2ALMNACYP1A2
SCHEMBL19789507 0.76 EPHX2 (0.38) RAB9AEPHX2NR1H4NPC1AR
SCHEMBL12265865 0.76 HTT (0.49) ARMEN1KMT2ALMNACYP1A2
SCHEMBL2158767 0.76 KDM4E (0.51) RAB9ANPC1MEN1KMT2ALMNA
SCHEMBL1468098 0.75 AR (0.46) RAB9AEPHX2NR1H4NPC1AR
SCHEMBL18927848 0.75 AR (0.44) RAB9AEPHX2NR1H4NPC1AR
SCHEMBL14193867 0.75 NR4A2 (0.45) RAB9ANPC1TDP1POLBALDH1A1
SCHEMBL14030018 0.75 POLB (0.51) ARMEN1KMT2ALMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1477848-B1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2012-12-05 EP disclosed
US-20070237890-A1 Bilayer Laminated Film for Bump Formation and Method of Bump Formation JSR CORPORATION (JP) 2007-10-11 US disclosed
US-7265044-B2 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2007-09-04 US disclosed
EP-1739487-A1 BILAYER LAMINATED FILM FOR BUMP FORMATION AND METHOD OF BUMP FORMATION JSR Corporation (JP) 2007-01-03 EP disclosed
US-7141355-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-11-28 US disclosed
US-20050277245-A1 Method for forming bump on electrode pad with use of double-layered film JSR CORPORATION (JP) 2005-12-15 US disclosed
EP-1542520-A1 METHOD FOR FORMING BUMP ON ELECTRODE PAD WITH USE OF DOUBLE-LAYERED FILM JSR Corporation (JP) 2005-06-15 EP disclosed
EP-1477848-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2004-11-17 EP disclosed
US-20040142280-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2004-07-22 US disclosed