SCHEMBL548275

SCHEMBL548275

O=S(=O)(Oc1ccc([S+](c2ccc(F)cc2)c2ccc(F)cc2)cc1)C(F)(F)F

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CXCR2 P25025 2/20 0.39
CXCR1 P25024 1/20 0.38
CA2 P00918 5/20 0.37
CA1 P00915 4/20 0.37
CA9 Q16790 4/20 0.37
CA12 O43570 2/20 0.37
SOS1 Q07889 1/20 0.37
HSD11B1 P28845 1/20 0.36
DRD2 P14416 1/20 0.35
DRD1 P21728 1/20 0.35
DRD4 P21917 1/20 0.35
DRD5 P21918 1/20 0.35
DRD3 P35462 1/20 0.35
KIF11 P52732 1/20 0.34
HTR1A P08908 2/20 0.34
HTR1D P28221 2/20 0.34
HTR1B P28222 2/20 0.34
FFAR1 O14842 2/20 0.33
FFAR4 Q5NUL3 1/20 0.33
MMP1 P03956 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL776070 0.89 CXCR2 (0.45) CXCR2CXCR1CA2CA1CA9
SCHEMBL13418131 0.87 CXCR2 (0.40) CXCR2CXCR1CA2CA1CA9
SCHEMBL547685 0.87 CXCR2 (0.40) CXCR2CXCR1CA2CA1CA9
Phosphine SCHEMBL29104332 0.87 CXCR2 (0.44) CXCR2CXCR1CA2CA1CA9
SCHEMBL3152157 0.84 CA1 (0.47) CXCR2CXCR1CA2CA1CA9
SCHEMBL24038175 0.83 KIF11 (0.49) CXCR2CXCR1CA2CA1CA9
SCHEMBL576035 0.80 CA2 (0.50) CXCR2CXCR1CA2CA1CA9
Biphenyl SCHEMBL23794913 0.79 CA2 (0.50) CXCR2CXCR1CA2CA1CA9
SCHEMBL7771915 0.79 CA2 (0.44) CXCR2CA2CA1CA9CA12
SCHEMBL5858648 0.78 CXCR2 (0.44) CXCR2CXCR1CA2CA1CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 142 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1111465-B1 Negative radiation-sensitive resin composition JSR CORP (JP) 2010-02-17 EP claimed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP claimed
WO-2026100410-A1 IODINE-CONTAINING POLYMERIZABLE COMPOUND AND IODINE-CONTAINING POLYMER 三菱瓦斯化学株式会社 2026-05-15 WO disclosed
US-20250362597-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-27 US disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
US-20240369924-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-11-07 US disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-20230096312-A1 RESIST COMPOSITION AND METHOD FOR USING RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-20070059632-A1 Method of manufacturing a semiconductor device MITSUBISHI GAS CHEMICAL CO., INC. (JP) 2007-03-15 US disclosed
EP-1739485-A1 RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-01-03 EP disclosed
EP-1666970-A1 COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2006-06-07 EP disclosed
US-20040191672-A1 Resist composition MITSUBISHI GAS CHEMICAL CO., LTD. (JP) 2004-09-30 US disclosed
EP-1443362-A2 Resist composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-08-04 EP disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
US-6468714-B2 FINE PHOTORESIST PATTERNS JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 CXCR2 2756/4885CXCR1 2863/4885CA2 3332/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R CXCR2 189/4885CXCR1 240/4885CA2 1466/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.