Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2988834 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL28758061 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL503245 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL206564 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL713096 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL200568 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL503931 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL200963 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL21362548 | 1.00 | LMNA (0.38) | LMNATHRB | |
| SCHEMBL5485826 | 1.00 | LMNA (0.38) | LMNATHRB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240132645-A1 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| US-20240132646-A1 | COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN | RESONAC CORPORATION (JP) | 2024-04-25 | — | — | US | disclosed |
| US-20240043597-A1 | COMPOSITION AND SHEET | RESONAC CORPORATION (JP) | 2024-02-08 | — | — | US | disclosed |
| US-20240043648-A1 | COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME | RESONAC CORPORATION (JP) | 2024-02-08 | — | — | US | disclosed |
| US-20240047230-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2024-02-08 | — | — | US | disclosed |
| CN-116917361-A | Composition containing compound having polyoxyalkylene chain and (meth) acrylamide compound | 株式会社力森诺科 | 2023-10-20 | — | — | CN | disclosed |
| CN-116917363-A | Composition containing compound having polyoxyalkylene chain and compound having poly (meth) acrylate chain | 株式会社力森诺科 | 2023-10-20 | — | — | CN | disclosed |
| CN-116710508-A | Composition and sheet | 株式会社力森诺科 | 2023-09-05 | — | — | CN | disclosed |
| CN-116685620-A | Composition and sheet comprising cured product thereof | 株式会社力森诺科 | 2023-09-01 | — | — | CN | disclosed |
| CN-116670806-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| CN-115052915-A | Composition containing a compound having a polyoxyalkylene chain | 昭和电工材料株式会社 | 2022-09-13 | — | — | CN | disclosed |
| CN-114729091-A | Curable composition set and article | 昭和电工材料株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-114651021-A | Curable composition and article | 昭和电工材料株式会社 | 2022-06-21 | — | — | CN | disclosed |
| CN-110760048-A | Aqueous emulsion, aqueous coating composition, and surface-protective resin member | 富士施乐株式会社 | 2020-02-07 | — | — | CN | disclosed |
| CN-110760051-A | Resin particle for adding surface-protecting resin member and surface-protecting resin member | 富士施乐株式会社 | 2020-02-07 | — | — | CN | disclosed |
| US-20200032101-A1 | AQUEOUS EMULSION, AQUEOUS COATING COMPOSITION, AND SURFACE PROTECTIVE RESIN MEMBER | FUJI XEROX CO., LTD. (JP) | 2020-01-30 | — | — | US | disclosed |
| US-20200031984-A1 | RESIN PARTICLES FOR ADDITION TO SURFACE PROTECTIVE RESIN MEMBER AND SURFACE PROTECTIVE RESIN MEMBER | FUJI XEROX CO., LTD. (JP) | 2020-01-30 | — | — | US | disclosed |
| EP-1686425-B1 | METHOD FOR FORMING MULTILAYER RESIST | DAIKIN IND LTD (JP) | 2018-06-13 | — | — | EP | disclosed |
| US-20070196763-A1 | Method of forming laminated resist | DAIKIN INDUSTRIES, LTD. | 2007-08-23 | — | — | US | disclosed |
| EP-1686425-A1 | METHOD FOR FORMING MULTILAYER RESIST | Daikin Industries, Ltd. (JP) | 2006-08-02 | — | — | EP | disclosed |