SCHEMBL548609

SCHEMBL548609

O=Cc1nccn1C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10644505 0.82
SCHEMBL7260805 0.75 LMNA (0.34)
SCHEMBL17541606 0.73
SCHEMBL27332692 0.71
SCHEMBL9254062 0.71
SCHEMBL27495376 0.71
SCHEMBL28079712 0.71
SCHEMBL16296076 0.71
SCHEMBL2906953 0.71
SCHEMBL28279446 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11530288-B2 Anhydrous routes to highly processable covalent network polymers and blends MALLINDA (US) 2022-12-20 US claimed
EP-3847201-A1 ANHYDROUS ROUTES TO HIGHLY PROCESSABLE COVALENT NETWORK POLYMERS AND BLENDS Mallinda (US) 2021-07-14 EP claimed
US-20200247937-A1 ANHYDROUS ROUTES TO HIGHLY PROCESSABLE COVALENT NETWORK POLYMERS AND BLENDS MALLINDA 2020-08-06 US claimed
EP-2808736-B1 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL CO (JP) 2018-07-18 EP claimed
EP-2808736-A2 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-12-03 EP claimed
EP-2662727-A2 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2013-11-13 EP claimed
US-11530288-B2 Anhydrous routes to highly processable covalent network polymers and blends MALLINDA (US) 2022-12-20 US disclosed
CN-113980926-A Magnetic nanoparticle-glycosyltransferase-amorphous metal organic framework composite catalytic material and preparation method and application thereof 南京师范大学 2022-01-28 CN disclosed
EP-3847201-A1 ANHYDROUS ROUTES TO HIGHLY PROCESSABLE COVALENT NETWORK POLYMERS AND BLENDS Mallinda (US) 2021-07-14 EP disclosed
US-20200247937-A1 ANHYDROUS ROUTES TO HIGHLY PROCESSABLE COVALENT NETWORK POLYMERS AND BLENDS MALLINDA 2020-08-06 US disclosed
EP-2080750-B1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2020-07-29 EP disclosed
EP-2808736-B1 Compound for resist and radiation-sensitive composition MITSUBISHI GAS CHEMICAL CO (JP) 2018-07-18 EP disclosed
US-9897913-B2 Radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-02-20 US disclosed
US-7919223-B2 Polyphenol compound synthesized by condensation between aromatic ketone or aldehyde and a phenol; acid-amplified, non-polymeric resist; highly sensitive to KrF excimer lasers, extreme ultraviolet rays, electron beams, X-rays; resist patterns with high resolution, high heat, etch resistance MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2011-04-05 US disclosed
US-20100047709-A1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-02-25 US disclosed
EP-2080750-A1 RADIATION-SENSITIVE COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2009-07-22 EP disclosed
US-20080113294-A1 Compound for Resist and Radiation-Sensitive Composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2008-05-15 US disclosed
EP-1830228-A1 COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-09-05 EP disclosed
US-7091281-B2 emulsion polymerization of an acrylic resin having an epoxy group and a hydroxyl group in the side chain, an unsaturated anionic emulsifier, an imidazole or imidazoline catalyst, and a silane compound having an epoxy and alkoxy group; improved corrosion resistance of electrically less noble metal alloys TORAY FINE CHEMICALS CO., LTD. (JP) 2006-08-15 US disclosed
US-20040220306-A1 Curable coating composition TORAY FINE CHEMICALS CO., LTD., A CORPORATION OF JAPAN (JP) 2004-11-04 US disclosed