⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2557501 | 0.91 | — | — | |
| SCHEMBL4354368 | 0.82 | — | — | |
| SCHEMBL550531 | 0.80 | — | — | |
| SCHEMBL11783468 | 0.78 | — | — | |
| SCHEMBL21630199 | 0.78 | — | — | |
| SCHEMBL504646 | 0.78 | OPRM1 (0.39) | — | |
| SCHEMBL11734520 | 0.75 | — | — | |
| SCHEMBL4612809 | 0.72 | CHRM1 (0.30) | — | |
| SCHEMBL2563668 | 0.70 | — | — | |
| SCHEMBL1607995 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12157844-B2 | Solvent-based pretreatment agent having improved adhesion to residual adhesive beads | SIKA TECHNOLOGY AG (CH) | 2024-12-03 | — | — | US | disclosed |
| US-11518918-B2 | Solvent-based primer having a long open time and improved adhesion | SIKA TECHNOLOGY AG (CH) | 2022-12-06 | — | — | US | disclosed |
| US-20220348793-A1 | SOLVENT-BASED PRETREATMENT AGENT HAVING IMPROVED ADHESION TO RESIDUAL ADHESIVE BEADS | SIKA TECHNOLOGY AG (CH) | 2022-11-03 | — | — | US | disclosed |
| EP-3630863-B1 | SOLVENT-BASED PRIMER WITH LONG OPEN TIME AND IMPROVED ADHESION | SIKA TECH AG (CH) | 2022-10-05 | — | — | EP | disclosed |
| EP-3688052-B1 | ACTIVATOR FOR ACCELERATED ADHESIVE COMPOSITION | SIKA TECH AG (CH) | 2021-11-10 | — | — | EP | disclosed |
| WO-2021122593-A1 | SOLVENT-BASED PRETREATMENT AGENT HAVING IMPROVED ADHESION TO RESIDUAL ADHESIVE BEADS | SIKA TECHNOLOGY AG (CH) | 2021-06-24 | — | — | WO | disclosed |
| US-20210171700-A1 | SOLVENT-BASED PRIMER HAVING A LONG OPEN TIME AND IMPROVED ADHESION | SIKA TECHNOLOGY AG (CH) | 2021-06-10 | — | — | US | disclosed |
| US-20200248041-A1 | ACTIVATOR FOR ACCELERATED ADHESION DEVELOPMENT | SIKA TECHNOLOGY AG (CH) | 2020-08-06 | — | — | US | disclosed |
| EP-3688052-A1 | ACTIVATOR FOR ACCELERATED ADHESION DEVELOPMENT | Sika Technology AG (CH) | 2020-08-05 | — | — | EP | disclosed |
| EP-3630863-A1 | SOLVENT-BASED PRIMER HAVING A LONG OPEN TIME AND IMPROVED ADHESION | Sika Technology AG (CH) | 2020-04-08 | — | — | EP | disclosed |
| EP-3406644-A1 | SOLVENT-BASED PRIMER WITH LONG OPEN TIME AND IMPROVED ADHESION | SIKA TECHNOLOGY AG (CH) | 2018-11-28 | — | — | EP | disclosed |
| EP-1652891-B1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO LTD (JP) | 2012-06-13 | — | — | EP | disclosed |
| US-8110645-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2012-02-07 | — | — | US | disclosed |
| EP-1788035-B1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | KONISHI CO LTD (JP) | 2011-01-19 | — | — | EP | disclosed |
| US-20090264602-A1 | Curable Resin Composition and Cold Setting Adhesive | KONISHI CO., LTD. (JP) | 2009-10-22 | — | — | US | disclosed |
| US-7576167-B2 | Curable resin composition | KONISHI CO., LTD. (JP) | 2009-08-18 | — | — | US | disclosed |
| US-20080312401-A1 | Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive | SATO SHINICHI | 2008-12-18 | — | — | US | disclosed |
| EP-1788035-A1 | REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE | Konishi Co., Ltd. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20060189736-A1 | Curable resin composition and cold-setting adhesive | KONISHI CO., LTD. (JP) | 2006-08-24 | — | — | US | disclosed |
| EP-1652891-A1 | CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE | KONISHI CO., LTD. (JP) | 2006-05-03 | — | — | EP | disclosed |