SCHEMBL551722

SCHEMBL551722

Cc1cc(Cc2cc(C(C)(C)CC(C)(C)C)cc(-n3nc4ccccc4n3)c2O)c(O)c(C(C)(C)C)c1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSPA5 P11021 2/20 0.49
SMN1; SMN2 Q16637 4/20 0.48
CYP2C9 P11712 3/20 0.48
HIF1A Q16665 3/20 0.48
CYP2C19 P33261 2/20 0.48
HSD17B10 Q99714 3/20 0.44
CYP2D6 P10635 1/20 0.44
NPC1 O15118 3/20 0.43
RAB9A P51151 3/20 0.43
POLB P06746 4/20 0.39
LMNA P02545 2/20 0.38
IDH1 O75874 1/20 0.35
ALDH1A1 P00352 3/20 0.34
CA2 P00918 1/20 0.34
TYR P14679 1/20 0.34
CYP3A4 P08684 3/20 0.33
ALOX15 P16050 1/20 0.33
USP2 O75604 3/20 0.32
KDM4E B2RXH2 2/20 0.32
MEN1 O00255 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30507646 1.00 HSPA5 (0.49) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
SCHEMBL8962738 0.93 NPC1 (0.50) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
SCHEMBL3090854 0.92 NPC1 (0.37) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
SCHEMBL29929989 0.91 HSPA5 (0.50) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
SCHEMBL3067219 0.91 NPC1 (0.46) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
SCHEMBL3076020 0.91 HSPA5 (0.55) HSPA5SMN1; SMN2CYP2C9HIF1ACYP2C19
Bisoctrizole SCHEMBL29358089 0.89 NPC1 (0.43) SMN1; SMN2CYP2C9HIF1AHSD17B10CYP2D6
Bisoctrizole SCHEMBL30113083 0.89 NPC1 (0.43) SMN1; SMN2CYP2C9HIF1AHSD17B10CYP2D6
Bisoctrizole SCHEMBL5994392 0.89 NPC1 (0.43) SMN1; SMN2CYP2C9HIF1AHSD17B10CYP2D6
Bisoctrizole SCHEMBL39191 0.89 NPC1 (0.43) SMN1; SMN2CYP2C9HIF1AHSD17B10CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 377 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023033890-A1 NITROGEN-CONTAINING COMPOUNDS AS ADDITIVES FOR SILICON-BASED LI-ION BATTERIES ENEVATE CORPORATION (US) 2023-03-09 WO claimed
EP-3467575-B1 EYEGLASS LENS ESSILOR INT (FR) 2022-01-05 EP claimed
US-6545069-B2 Ultraviolet radiation shields IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2003-04-08 US claimed
US-20010025069-A1 Polypropylene resin-based films and sheets IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2001-09-27 US claimed
EP-1095956-A2 Thermoset Polyurethane resin and method for the production thereof Mitsui Chemicals, Inc. (JP) 2001-05-02 EP claimed
US-6201061-B1 CURING A RESIN FOR OPTICAL USE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-03-13 US claimed
US-6037394-A ACRYLIC RESIN, BENZOTRIAZOLE, SOLVENT, AND ALKOXYSILANE REACTION PRODUCT WITH SILYLATION AGENT; PROTECTIVE COATINGS, WEAR RESISTANCE, WEATHERPROOFING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-03-14 US claimed
EP-0934987-A1 Primer composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-08-11 EP claimed
US-5932142-A REACTING 2-HYDROXYPHENYLBENZOTRIAZOLE AND 2,4-DISUBSTITUTED PHENOL WITH AN ALDEHYDE JOHOKU CHEMICAL CO., LTD. (JP) 1999-08-03 US claimed
US-20260108989-A1 FLUX AND SOLDER PASTE SENJU METAL INDUSTRY CO (JP) 2026-04-23 US disclosed
US-12605794-B2 Flux and solder paste SENJU METAL INDUSTRY CO., LTD. (JP) 2026-04-21 US disclosed
US-12605783-B2 Method for manufacturing soldered products DENSO CORPORATION (JP) 2026-04-21 US disclosed
EP-4706873-A1 FLUX AND SOLDER PASTE Senju Metal Industry Co., Ltd. (JP) 2026-03-11 EP disclosed
US-12569941-B2 Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device SENJU METAL INDUSTRY CO., LTD. (JP) 2026-03-10 US disclosed
US-6201061-B1 CURING A RESIN FOR OPTICAL USE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2001-03-13 US disclosed
EP-1077246-A2 Use of benzotriazolyl-alkylene bisphenol compounds as antioxidants for organic materials Johoku Chemical Co., Ltd. (JP) 2001-02-21 EP disclosed
US-6037394-A ACRYLIC RESIN, BENZOTRIAZOLE, SOLVENT, AND ALKOXYSILANE REACTION PRODUCT WITH SILYLATION AGENT; PROTECTIVE COATINGS, WEAR RESISTANCE, WEATHERPROOFING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-03-14 US disclosed
EP-0950905-A2 Process for producing a novel resin for optical materials having excellent color tone and transparency MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1999-10-20 EP disclosed
EP-0934987-A1 Primer composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-08-11 EP disclosed
EP-0847997-A1 Benzotriazolyl-alkylene bisphenol compounds, process for their preparation, and stabilized organic materials containing them Johoku Chemical Co., Ltd. (JP) 1998-06-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12569941-B2 Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device BCL2L1, BCL2L2, SCO2 HSPA5 597/4885SMN1; SMN2 194/4885CYP2C9 1495/4885
US-20260108989-A1 FLUX AND SOLDER PASTE GRIN1, ROS1, PRXL2A HSPA5 3732/4885SMN1; SMN2 455/4885CYP2C9 4739/4885
US-12605783-B2 Method for manufacturing soldered products ROS1, TFRC, MARK2 HSPA5 166/4885SMN1; SMN2 235/4885CYP2C9 2196/4885
US-12605794-B2 Flux and solder paste RIOK2, TRA2B, BAG2 HSPA5 319/4885SMN1; SMN2 165/4885CYP2C9 3946/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.