SCHEMBL5518569

SCHEMBL5518569

O=C(O)c1ccc(C(c2ccc(O)cc2)c2ccc(O)cc2)cc1

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 3/20 0.73
CA1 P00915 2/20 0.73
CA12 O43570 1/20 0.73
CA3 P07451 1/20 0.73
TYR P14679 1/20 0.73
DRD1 P21728 1/20 0.73
CA4 P22748 1/20 0.73
CA6 P23280 1/20 0.73
CA5A P35218 1/20 0.73
CA7 P43166 1/20 0.73
CA9 Q16790 1/20 0.73
CA14 Q9ULX7 1/20 0.73
CA5B Q9Y2D0 1/20 0.73
SRD5A2 P31213 2/20 0.64
TSHR P16473 3/20 0.55
TP53 P04637 1/20 0.55
ALDH1A1 P00352 2/20 0.53
GAA P10253 1/20 0.53
KMT2A Q03164 1/20 0.53
TDP1 Q9NUW8 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL900831 0.91 TSHR (0.67) CA2CA1CA12CA3TYR
SCHEMBL17942904 0.90 ALDH1A1 (0.63) CA2CA1CA12CA3TYR
Paraben SCHEMBL4110 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Terephthalic Acid SCHEMBL6692916 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Paraben SCHEMBL3212865 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Paraben SCHEMBL5311518 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Terephthalic Acid SCHEMBL3460105 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Paraben SCHEMBL7622776 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
Paraben SCHEMBL20500516 0.85 CA2 (1.00) CA2CA1CA12CA3TYR
SCHEMBL1552114 0.84 HDAC1 (0.64) CA2CA1CA12CA3TYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114292564-A CaCO (calcium carbonate)3Grafted polyether sulfone modified epoxy resin composite material and preparation method thereof 陈宝山 2022-04-08 CN claimed
CN-112546883-B Polyelectrolyte, preparation and application thereof, polyelectrolyte ultrafiltration membrane, preparation and application thereof 吉林大学 2022-02-15 CN claimed
CN-112546883-A Polyelectrolyte, preparation and application thereof, polyelectrolyte ultrafiltration membrane, preparation and application thereof 吉林大学 2021-03-26 CN claimed
CN-111635526-B Polyether imide polymer containing carboxyl side group and preparation method and application thereof 吉林大学 2021-03-23 CN claimed
CN-111635526-A Polyether imide polymer containing carboxyl side group and preparation method and application thereof 吉林大学 2020-09-08 CN claimed
CN-114292564-A CaCO (calcium carbonate)3Grafted polyether sulfone modified epoxy resin composite material and preparation method thereof 陈宝山 2022-04-08 CN disclosed
CN-112546883-B Polyelectrolyte, preparation and application thereof, polyelectrolyte ultrafiltration membrane, preparation and application thereof 吉林大学 2022-02-15 CN disclosed
CN-112546883-A Polyelectrolyte, preparation and application thereof, polyelectrolyte ultrafiltration membrane, preparation and application thereof 吉林大学 2021-03-26 CN disclosed
CN-111635526-B Polyether imide polymer containing carboxyl side group and preparation method and application thereof 吉林大学 2021-03-23 CN disclosed
CN-111635526-A Polyether imide polymer containing carboxyl side group and preparation method and application thereof 吉林大学 2020-09-08 CN disclosed
EP-2957955-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE SHINETSU CHEMICAL CO (JP) 2018-06-06 EP disclosed
US-9557645-B2 Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-31 US disclosed
US-20150198883-A1 NEGATIVE RESIST COMPOSITION AND PATTERNING PROCESS USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-07-16 US disclosed
EP-2842984-A1 Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate Shin-Etsu Chemical Co., Ltd. (JP) 2015-03-04 EP disclosed
US-20150056545-A1 POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-26 US disclosed
US-20150056545-A1 POLYMER COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM AND PRODUCTION METHOD THEREOF, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-26 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed