SCHEMBL551940

SCHEMBL551940

CCCCC(CC)C[C@](O)(Cc1cc(C(C)(C)C)c(O)c(C(C)(C)C)c1)C(=O)S

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.40
ALDH1A1 P00352 4/20 0.40
KMT2A Q03164 3/20 0.40
ATM Q13315 3/20 0.40
NPSR1 Q6W5P4 3/20 0.40
MEN1 O00255 2/20 0.40
CYP1A2 P05177 2/20 0.40
CYP3A4 P08684 2/20 0.40
MAPK1 P28482 2/20 0.40
BLM P54132 2/20 0.40
HIF1A Q16665 2/20 0.40
MAPT P10636 2/20 0.40
USP2 O75604 1/20 0.40
CYP2D6 P10635 1/20 0.40
LMNA P02545 3/20 0.39
GMNN O75496 1/20 0.39
GABBR2 O75899 1/20 0.39
TP53 P04637 1/20 0.39
CYP2C9 P11712 1/20 0.39
ALOX15 P16050 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9430963 0.81 KMT2A (0.42) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL888619 0.76 HMGCR (0.47) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL21267976 0.75 HMGCR (0.41) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL9674260 0.72 ALDH1A1 (0.44) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL9398396 0.71 MAPK1 (0.42) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL283905 0.71 CYP3A4 (0.51) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL16270988 0.71 GAA (0.48) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL11348391 0.70 GSR (0.51) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL2679600 0.70 CYP3A4 (0.40) TSHRALDH1A1KMT2AATMNPSR1
SCHEMBL14174524 0.70 GAA (0.64) TSHRALDH1A1KMT2AMEN1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
EP-0374813-B1 Magnetic recording medium BASF AG (DE) 1996-07-24 EP disclosed
EP-0374813-A2 Magnetic recording medium BASF Aktiengesellschaft (DE) 1990-06-27 EP disclosed