SCHEMBL551942

SCHEMBL551942

CCCCC(CC)CC(SCc1cc(C(C)(C)C)c(O)c(C(C)(C)C)c1)C(=O)O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 6/20 0.37
KMT2A Q03164 3/20 0.37
EPHX1 P07099 1/20 0.36
ATM Q13315 2/20 0.36
NPSR1 Q6W5P4 2/20 0.36
XBP1 P17861 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
HMGCR P04035 1/20 0.34
MEN1 O00255 2/20 0.34
ALDH1A1 P00352 2/20 0.34
TSHR P16473 2/20 0.34
MAPK1 P28482 2/20 0.34
USP2 O75604 1/20 0.34
CYP1A2 P05177 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2D6 P10635 1/20 0.34
MAPT P10636 1/20 0.34
BLM P54132 1/20 0.34
HIF1A Q16665 1/20 0.34
LMNA P02545 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2348461 0.85 L3MBTL1 (0.37) GAAEPHX1ATMNPSR1XBP1
SCHEMBL39863 0.83 GAA (0.40) GAAKMT2AEPHX1ATMNPSR1
SCHEMBL2565851 0.83 GAA (0.40) GAAKMT2AEPHX1ATMNPSR1
SCHEMBL247710 0.83 GAA (0.40) GAAKMT2AEPHX1ATMNPSR1
SCHEMBL11483346 0.83 GAA (0.40) GAAKMT2AEPHX1ATMNPSR1
SCHEMBL9398396 0.80 MAPK1 (0.42) GAAKMT2AATMNPSR1XBP1
SCHEMBL8527204 0.79 VCAM1 (0.37) GAAKMT2AATMNPSR1HMGCR
SCHEMBL76503 0.79 VCAM1 (0.37) GAAKMT2AATMNPSR1HMGCR
SCHEMBL4991668 0.78 ALDH1A1 (0.42) GAAKMT2AEPHX1ATMNPSR1
SCHEMBL10781728 0.75 EPHX1 (0.51) GAAKMT2AEPHX1ATMNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed