SCHEMBL5523047

SCHEMBL5523047

Cc1ccc(-c2cccc(C3CCCCC3)c2O)c(O)c1-c1cccc(C2CCCCC2)c1O

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ PTPN5 P54829 4/20 0.45
▸ PTPN2 P17706 1/20 0.45
▸ FEN1 P39748 4/20 0.41
▸ ALOX5AP P20292 3/20 0.38
▸ ELANE P08246 3/20 0.37
▸ CTSG P08311 1/20 0.37
▸ PTGS2 P35354 1/20 0.37
▸ HTR2C P28335 3/20 0.34
▸ ADRA2A P08913 2/20 0.34
▸ ADRA2B P18089 2/20 0.34
▸ ADRA2C P18825 2/20 0.34
▸ SLC6A3 Q01959 2/20 0.34
▸ NUDT1 P36639 1/20 0.33
▸ BACE1 P56817 1/20 0.33
▸ KDM4E B2RXH2 1/20 0.33
▸ MEN1 O00255 1/20 0.33
▸ MAPT P10636 1/20 0.33
▸ KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5520332 0.91 PTPN5 (0.45) PTPN5PTPN2FEN1ALOX5APELANE
SCHEMBL5520487 0.87 PTPN5 (0.44) PTPN5PTPN2FEN1ALOX5APELANE
SCHEMBL28807399 0.85 PTPN5 (0.45) PTPN5PTPN2FEN1ALOX5APELANE
SCHEMBL27936382 0.84 PTPN5 (0.46) PTPN5PTPN2FEN1ALOX5APPTGS2
SCHEMBL21626185 0.84 PTPN5 (0.52) PTPN5PTPN2FEN1ALOX5APPTGS2
SCHEMBL27936319 0.81 PTPN5 (0.44) PTPN5PTPN2FEN1PTGS2MEN1
SCHEMBL673222 0.77 ALDH1A1 (0.48) PTPN5PTPN2FEN1ALOX5APHTR2C
SCHEMBL30218222 0.77 ALDH1A1 (0.48) PTPN5PTPN2FEN1ALOX5APHTR2C
SCHEMBL8954630 0.77 ALDH1A1 (0.48) PTPN5PTPN2FEN1ALOX5APHTR2C
SCHEMBL9137402 0.77 KDM4E (0.37) PTPN5PTPN2FEN1ALOX5APHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114902135-B Positive photosensitive resin composition, cured film, and resist film DIC株式会社 2024-07-02 — — CN disclosed
CN-115873214-A Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film DIC株式会社 2023-03-31 — — CN disclosed
CN-107703717-B Positive photosensitive resin composition, method for producing metal wiring, and laminate 东京应化工业株式会社 2023-01-24 — — CN disclosed
CN-114902135-A Positive photosensitive resin composition, cured film and resist film DIC株式会社 2022-08-12 — — CN disclosed
CN-107703685-B Laminate and method for producing laminate 东京应化工业株式会社 2022-03-18 — — CN disclosed
CN-107703658-B Method for manufacturing substrate 东京应化工业株式会社 2022-02-25 — — CN disclosed
CN-113687573-A Positive photosensitive resin composition, method for forming patterned resist film, and patterned resist film 东京应化工业株式会社 2021-11-23 — — CN disclosed
CN-109790263-B Phenolic hydroxyl group-containing resin and resist material DIC株式会社 2021-09-17 — — CN disclosed
CN-113348188-A Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2021-09-03 — — CN disclosed
CN-113227181-A Resist composition DIC株式会社 2021-08-06 — — CN disclosed
US-20170137556-A1 PHENOLIC HYDROXYL GROUP-CONTAINING RESIN, PRODUCTION METHOD THEREFOR, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL, COATING FILM, CURABLE COMPOSITION AND CURED PRODUCT THEREOF, AND RESIST UNDERLAYER FILM DIC CORPORATION (JP) 2017-05-18 — — US disclosed
US-20170082923-A1 PHOTOSENSITIVE COMPOSITION FOR PERMANENT FILMS, RESIST MATERIAL AND COATING FILM DIC CORPORATION (JP) 2017-03-23 — — US disclosed
US-20170066703-A1 COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, METHOD FOR PRODUCING COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL, AND RESIST COATING FILM DIC CORPORATION (JP) 2017-03-09 — — US disclosed
US-20160177020-A1 MODIFIED HYDROXY NAPHTHALENE NOVOLAK RESIN, PRODUCTION METHOD FOR MODIFIED HYDROXY NAPHTHALENE NOVOLAK RESIN, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL AND COATING DIC CORPORATION (JP) 2016-06-23 — — US disclosed
US-20070248905-A1 TWO-LAYER FILM AND METHOD OF FORMING PATTERN WITH THE SAME JSR CORPORATION (JP) 2007-10-25 — — US disclosed
US-7247420-B2 Two-layer film and method of forming pattern with the same JSR CORPORATION (JP) 2007-07-24 — — US disclosed
EP-1469353-A1 TWO-LAYER FILM AND METHOD OF FORMING PATTERN WITH THE SAME JSR Corporation (JP) 2004-10-20 — — EP disclosed
US-20040131963-A1 Two-layer film and method of forming pattern with the same JSR CORPORATION (JP) 2004-07-08 — — US disclosed
US-5677102-A DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING TOKYO OHKA KOGYO CO., LTD. (JP) 1997-10-14 — — US disclosed
US-5604077-A MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-18 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170066703-A1 COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, METHOD FOR PRODUCING COMPOUND CONTAINING MODIFIED PHENOLIC HYDROXY GROUP, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL, AND RESIST COATING FILM PAH, TYR, HACL2 PTPN5 2894/4885PTPN2 2904/4885FEN1 4309/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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