Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 1/20 | 0.38 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.38 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | PRKCE | Q02156 | 2/20 | 0.34 |
| ▸ | MYLK | Q15746 | 2/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | PRKCG | P05129 | 1/20 | 0.34 |
| ▸ | PRKCA | P17252 | 1/20 | 0.34 |
| ▸ | APEX1 | P27695 | 1/20 | 0.34 |
| ▸ | RECQL | P46063 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.33 |
| ▸ | ELANE | P08246 | 1/20 | 0.32 |
| ▸ | CD69 | Q07108 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25767416 | 0.88 | GABRA1 (0.34) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL11365064 | 0.88 | GABRA1 (0.38) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL25446784 | 0.81 | SHBG (0.40) | TDP1ALDH1A1PRKCEMYLKMAPT | |
| SCHEMBL12353847 | 0.81 | GABRA1 (0.39) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL14999487 | 0.81 | PTGS2 (0.39) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL25446807 | 0.80 | PRKCE (0.41) | CYP2C19TDP1ALDH1A1PRKCEMYLK | |
| SCHEMBL913881 | 0.79 | GABRA1 (0.38) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL16673552 | 0.79 | GABRA1 (0.38) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL914375 | 0.79 | CYP2C19 (0.40) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 | |
| SCHEMBL2114143 | 0.79 | CYP2C19 (0.55) | GABRA1GABRB2CYP2C19TDP1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350305-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID | FUJIFILM CORPORATION (JP) | 2023-11-02 | — | — | US | disclosed |
| US-20230213858-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2023-07-06 | — | — | US | disclosed |
| US-20230143007-A1 | MULTILAYER OBJECT AND RELEASE AGENT COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| WO-2014010392-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANKS INCLUDING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD AND PHOTOMASK | FUJIFILM CORPORATION (JP) | 2014-01-16 | — | — | WO | disclosed |
| WO-2013141376-A1 | PROTECTANT, METHOD FOR PRODUCING COMPOUND PROTECTED BY PROTECTANT, RESIN PROTECTED BY PROTECTANT, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING RESIN PROTECTED BY PROTECTANT, PATTERN-FORMING MATERIAL, PHOTOSENSITIVE FILM, CURED RELIEF PATTERN, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-09-26 | — | — | WO | disclosed |
| WO-2013018524-A1 | PHOTOSENSITIVE RESIN COMPOSITION, MATERIAL FOR FORMING RELIEF PATTERN, PHOTOSENSITIVE FILM, POLYIMIDE FILM, CURED RELIEF PATTERN AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 (JP) | 2013-02-07 | — | — | WO | disclosed |
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-8173349-B2 | Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device | FUJIFILM CORPORATION (JP) | 2012-05-08 | — | — | US | disclosed |
| US-20100080963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-20100080963-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-7615324-B2 | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same | FUJIFILM CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-7598009-B2 | Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device | FUJIFILM CORPORATION (JP) | 2009-10-06 | — | — | US | disclosed |
| US-7598009-B2 | Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device | FUJIFILM CORPORATION (JP) | 2009-10-06 | — | — | US | disclosed |
| US-20090035693-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20090035693-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN USING IT, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2009-02-05 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |
| US-20080227024-A1 | PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-09-18 | — | — | US | disclosed |