SCHEMBL5534309

SCHEMBL5534309

C=CC(=O)OCc1cc(C)c(O)c(C)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MET P08581 3/20 0.43
TSHR P16473 6/20 0.39
PTGS1 P23219 2/20 0.39
PTGS2 P35354 2/20 0.39
HMGB1 P09429 1/20 0.39
CXCL12 P48061 1/20 0.39
ESR1 P03372 2/20 0.38
HPGD P15428 1/20 0.38
ALDH1A1 P00352 3/20 0.37
TP53 P04637 2/20 0.37
HIF1A Q16665 2/20 0.37
CYP3A4 P08684 2/20 0.37
HSD17B10 Q99714 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2D6 P10635 1/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2B6 P20813 1/20 0.37
THRB P10828 2/20 0.36
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11232750 0.87 GAA (0.47) METTSHRALDH1A1TP53HIF1A
SCHEMBL21913948 0.83 TSHR (0.46) METTSHRHPGDALDH1A1TP53
SCHEMBL21244244 0.82 MET (0.42) METTSHRHPGDALDH1A1TP53
SCHEMBL22667466 0.82 MET (0.42) METTSHRHPGDALDH1A1TP53
SCHEMBL19700929 0.81 THRB (0.41) METTSHRHPGDALDH1A1TP53
SCHEMBL25311654 0.80 MET (0.67) METCYP3A4CYP1A2CYP2D6CYP2C9
SCHEMBL2265057 0.79 GAA (0.55) METTSHRHPGDALDH1A1TP53
SCHEMBL24191462 0.79 ALDH1A1 (0.48) METTSHRHPGDALDH1A1TP53
SCHEMBL13057612 0.78 ALDH1A1 (0.52) METPTGS1PTGS2HMGB1CXCL12
SCHEMBL15339015 0.78 TSHR (0.42) METTSHRHPGDALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4067999-B1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
EP-4067999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-10-05 EP disclosed
EP-1729176-B1 POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2017-06-28 EP disclosed
US-20070190465-A1 Positively radiation-sensitive resin composition JSR CORPORATION (JP) 2007-08-16 US disclosed
EP-1729176-A1 POSITIVELY RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2006-12-06 EP disclosed
US-4131644-A TREATING POLYBUTADIENE WITH A LEWIS ACID AND A SULFUR MELT, CARBONIZING UBE INDUSTRIES, INC. (JP) 1978-12-26 US disclosed