Known targets — ChEMBL curated mechanism
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
The experimentally established mechanism targets of Phosphoric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 1/20 | 0.46 |
| ▸ | CA4 | P22748 | 1/20 | 0.46 |
| ▸ | CA5A | P35218 | 1/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.45 |
| ▸ | TSHR | P16473 | 2/20 | 0.45 |
| ▸ | MIF | P14174 | 1/20 | 0.44 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.43 |
| ▸ | CFTR | P13569 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | SRC | P12931 | 2/20 | 0.37 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.35 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.35 |
| ▸ | HTR3E | A5X5Y0 | 1/20 | 0.34 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.34 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.34 |
| ▸ | SLC22A3 | O75751 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphoric Acid SCHEMBL28558146 | 1.00 | CA2 (0.46) | CA2CA4CA5ACYP3A4TSHR | |
| SCHEMBL1025545 | 0.91 | CA2 (0.43) | CA2CA4CA5ACYP3A4TSHR | |
| SCHEMBL27453541 | 0.89 | MIF (0.48) | CA2CA4CA5ACYP3A4TSHR | |
| SCHEMBL169930 | 0.89 | MIF (0.48) | CA2CA4CA5ACYP3A4TSHR | |
| Benzene SCHEMBL11510532 | 0.88 | MIF (0.55) | CYP3A4TSHRMIFALDH1A1MEN1 | |
| SCHEMBL245090 | 0.88 | MIF (0.55) | CYP3A4TSHRMIFALDH1A1MEN1 | |
| SCHEMBL19459346 | 0.88 | MIF (0.55) | CYP3A4TSHRMIFALDH1A1MEN1 | |
| SCHEMBL1332539 | 0.88 | — | — | |
| SCHEMBL5925 | 0.88 | — | — | |
| Hydrogen Sulfide SCHEMBL2017797 | 0.85 | MIF (0.52) | CYP3A4TSHRMIFALDH1A1MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4389844-A1 | ADHESIVE SHEET | Nitto Denko Corporation (JP) | 2024-06-26 | — | — | EP | disclosed |
| US-8697767-B2 | Production method for pressure-sensitive adhesive composition | NITTO DENKO CORPORATION (JP) | 2014-04-15 | — | — | US | disclosed |
| EP-2567995-B1 | Resin composition for printing plate | ASAHI KASEI E MATERIALS CORP (JP) | 2014-02-19 | — | — | EP | disclosed |
| US-20130085202-A1 | PRODUCTION METHOD FOR PRESSURE-SENSITIVE ADHESIVE COMPOSITION | NITTO DENKO CORPORATION (JP) | 2013-04-04 | — | — | US | disclosed |
| US-20130084416-A1 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2013-04-04 | — | — | US | disclosed |
| US-20130085250-A1 | HEAT-ADHERENT FILM AND PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2013-04-04 | — | — | US | disclosed |
| EP-2567995-A2 | Resin composition for printing plate | Asahi Kasei E-materials Corporation (JP) | 2013-03-13 | — | — | EP | disclosed |
| EP-2100907-B1 | RESIN COMPOSITION FOR PRINTING PLATE | ASAHI KASEI E MATERIALS CORP (JP) | 2013-02-20 | — | — | EP | disclosed |
| US-8263730-B2 | Resin composition for printing plate | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2012-09-11 | — | — | US | disclosed |
| US-20120148949-A1 | RESIN COMPOSITION FOR PRINTING PLATE | ASAHI KASEI E-MATERIALS CORPORATION | 2012-06-14 | — | — | US | disclosed |
| EP-1762582-B1 | EPOXY RESIN COMPOSITION | NAMICS CORP (JP) | 2012-05-09 | — | — | EP | disclosed |
| US-8129494-B2 | Resin composition for printing plate | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2012-03-06 | — | — | US | disclosed |
| US-7932108-B2 | Method of preparing a sealed light-emitting diode chip | NAMICS CORPORATION (JP) | 2011-04-26 | — | — | US | disclosed |
| US-20100093119-A1 | RESIN COMPOSITION FOR PRINTING PLATE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2010-04-15 | — | — | US | disclosed |
| EP-2100907-A1 | RESIN COMPOSITION FOR PRINTING PLATE | Asahi Kasei Chemicals Corporation (JP) | 2009-09-16 | — | — | EP | disclosed |
| US-20090020779-A1 | Method of preparing a sealed light-emitting diode chip | NAMICS CORPORATION (JP) | 2009-01-22 | — | — | US | disclosed |
| US-20080020231-A1 | Epoxy Resin Composition | NAMICS CORPORATION (JP) | 2008-01-24 | — | — | US | disclosed |
| EP-1762582-A1 | EPOXY RESIN COMPOSITION | Namics Corporation (JP) | 2007-03-14 | — | — | EP | disclosed |