SCHEMBL5586997

SCHEMBL5586997

Cc1cc(C)cc(NCCCCS(=O)(=O)O)c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.44
ALDH1A1 P00352 1/20 0.38
CA12 O43570 3/20 0.37
CA1 P00915 3/20 0.37
CA2 P00918 3/20 0.37
CA7 P43166 2/20 0.37
HDAC3 O15379 1/20 0.37
HDAC4 P56524 1/20 0.37
HDAC1 Q13547 1/20 0.37
HDAC7 Q8WUI4 1/20 0.37
HDAC2 Q92769 1/20 0.37
HDAC10 Q969S8 1/20 0.37
HDAC11 Q96DB2 1/20 0.37
HDAC8 Q9BY41 1/20 0.37
HDAC6 Q9UBN7 1/20 0.37
HDAC9 Q9UKV0 1/20 0.37
HDAC5 Q9UQL6 1/20 0.37
HTT P42858 2/20 0.36
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28604711 0.98 THRB (0.43) THRBALDH1A1CA12CA1CA2
SCHEMBL28590884 0.98 THRB (0.43) THRBALDH1A1CA12CA1CA2
SCHEMBL1823998 0.96 THRB (0.44) THRBALDH1A1CA12CA1CA2
SCHEMBL4940220 0.83 MAPT (0.61) ALDH1A1HDAC3HDAC4HDAC1HDAC7
SCHEMBL2111043 0.83 MTNR1A (0.39) ALDH1A1HTTMAPTKMT2A
SCHEMBL1257436 0.82 MAPT (0.59) ALDH1A1HDAC1HTTCYP1A2CYP3A4
SCHEMBL8969909 0.82 MAPT (0.59) ALDH1A1HDAC3HDAC4HDAC1HDAC7
SCHEMBL17195403 0.82 MAPT (0.55) ALDH1A1CA12CA1CA2HDAC1
SCHEMBL1897682 0.80 MAPT (0.61) ALDH1A1HDAC3HDAC4HDAC1HDAC7
SCHEMBL9551536 0.79 MAPT (0.59) ALDH1A1HDAC1HTTCYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109863261-B Defect-free filling method of through silicon via and copper plating solution used for filling method 韩国生产技术研究院 2021-08-20 CN claimed
CN-109863261-A The zero defect fill method of silicon through electrode and copper plating bath for the fill method 韩国生产技术研究院 2019-06-07 CN claimed
CN-110042146-B Method for testing blood sample 雅培快速诊断国际无限公司 2023-09-01 CN disclosed
CN-115135331-A Rhodospirillum rubrum cells for lowering plasma cholesterol while leaving other serum protein levels unaffected 埃兹科尔公司 2022-09-30 CN disclosed
CN-108700503-B Biometric identification system 泰斯科有限公司 2021-12-03 CN disclosed
CN-107923838-B Biological material measuring instrument 泰斯科有限公司 2021-11-26 CN disclosed
CN-109863261-B Defect-free filling method of through silicon via and copper plating solution used for filling method 韩国生产技术研究院 2021-08-20 CN disclosed
CN-109863261-A The zero defect fill method of silicon through electrode and copper plating bath for the fill method 韩国生产技术研究院 2019-06-07 CN disclosed
CN-108026656-A Electro-coppering organic additive comprising two kinds of leveling agents and the electrolytic copper plating solution comprising the additive 韩国生产技术研究院 2018-05-11 CN disclosed
EP-1203959-B1 ANALYZING CARTRIDGE AND LIQUID FEED CONTROL DEVICE ASAHI CHEMICAL IND (JP) 2007-06-13 EP disclosed
EP-1203959-A1 ANALYZING CARTRIDGE AND LIQUID FEED CONTROL DEVICE Asahi Kasei Kabushiki Kaisha (JP) 2002-05-08 EP disclosed