SCHEMBL5611643

SCHEMBL5611643

Cc1cc(O)c(O)c(-c2cccc3ccccc23)c1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.50
HTT P42858 1/20 0.50
PTGS1 P23219 1/20 0.45
PTGS2 P35354 1/20 0.45
BCL2L1 Q07817 1/20 0.44
DHFR P00374 1/20 0.43
ALDH1A1 P00352 3/20 0.42
CYP1A2 P05177 2/20 0.42
CYP2A6 P11509 1/20 0.42
MCL1 Q07820 1/20 0.41
ACMSD Q8TDX5 1/20 0.41
TLR8 Q9NR97 1/20 0.41
PTPN22 Q9Y2R2 1/20 0.40
CA12 O43570 2/20 0.40
CA1 P00915 2/20 0.40
CA2 P00918 2/20 0.40
CA9 Q16790 2/20 0.40
PKM P14618 1/20 0.40
HPGD P15428 2/20 0.39
HSD17B10 Q99714 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30535784 0.85 PTGS1 (0.46) LMNAHTTPTGS1PTGS2BCL2L1
SCHEMBL5611648 0.83 DHFR (0.43) LMNAHTTPTGS1PTGS2BCL2L1
SCHEMBL2534631 0.81 ALDH1A1 (0.47) LMNAHTTPTGS1PTGS2BCL2L1
SCHEMBL30117593 0.81 TRPM4 (0.48) DHFRALDH1A1CYP1A2MCL1ACMSD
SCHEMBL888517 0.81 TRPM4 (0.48) DHFRALDH1A1CYP1A2MCL1ACMSD
SCHEMBL29428933 0.81 TRPM4 (0.48) DHFRALDH1A1CYP1A2MCL1ACMSD
SCHEMBL30719629 0.77 PTGS1 (0.53) LMNAHTTPTGS1PTGS2ALDH1A1
SCHEMBL249794 0.77 CYP1A2 (0.52) DHFRALDH1A1CYP1A2CYP2A6MCL1
SCHEMBL8597722 0.77 CYP1A2 (0.47) DHFRALDH1A1CYP1A2MCL1ACMSD
SCHEMBL17500095 0.77 PTGS1 (0.53) LMNAHTTPTGS1PTGS2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7271219-B2 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-09-18 US disclosed
US-20040102601-A1 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-05-27 US disclosed
EP-1375553-A1 CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-02 EP disclosed