SCHEMBL561584

SCHEMBL561584

C1OC1C[N+](CC1CO1)(CC1CO1)CC1CO1

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CHRM2 P08172 14/20 0.42
CHRM5 P08912 10/20 0.42
CHRM3 P20309 10/20 0.42
CHRM4 P08173 7/20 0.42
ALDH1A1 P00352 3/20 0.42
TDP1 Q9NUW8 1/20 0.42
CHRM1 P11229 6/20 0.39
TSHR P16473 2/20 0.39
MAPK1 P28482 1/20 0.39
KDM4E B2RXH2 1/20 0.37
HTT P42858 1/20 0.37
TP53 P04637 1/20 0.33
HBB P68871 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10704893 0.82 ALDH1A1 (0.48) CHRM2CHRM5CHRM3CHRM4ALDH1A1
SCHEMBL587256 0.82 CHRM2 (0.41) CHRM2CHRM5CHRM3CHRM4ALDH1A1
Bromide SCHEMBL455129 0.80 CHRM2 (0.40) CHRM2CHRM5CHRM3CHRM4ALDH1A1
Hydrochloric Acid SCHEMBL194217 0.80 CHRM2 (0.40) CHRM2CHRM5CHRM3CHRM4ALDH1A1
SCHEMBL5196667 0.78 SLC22A1 (0.43) CHRM2CHRM5CHRM3CHRM4ALDH1A1
Hydrochloric Acid SCHEMBL25244151 0.76 CHRM2 (0.33) CHRM2CHRM5CHRM3CHRM4ALDH1A1
SCHEMBL8044658 0.76 ALDH1A1 (0.40) CHRM2CHRM5CHRM3CHRM4ALDH1A1
SCHEMBL11125585 0.76 CHRM2 (0.38) CHRM2CHRM5CHRM3CHRM4ALDH1A1
SCHEMBL4744717 0.76 ALDH1A1 (0.40) CHRM2CHRM5CHRM3CHRM4ALDH1A1
Bromide SCHEMBL18260613 0.76 SLC22A1 (0.41) CHRM2CHRM5CHRM3CHRM4ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 513 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256063-A Epoxy resin composition and method for preparing same 清华大学 2024-06-28 CN claimed
CN-118240513-A Epoxy adhesive and preparation method thereof 中国石油天然气集团有限公司 2024-06-25 CN claimed
CN-118206943-A Quick-curing high-temperature-resistant high-humidity-resistant metal adhesive and preparation method thereof 深圳市麦捷微电子科技股份有限公司 2024-06-18 CN claimed
CN-115851222-B Soft copper foil substrate bonding material and preparation method thereof 烟台德邦科技股份有限公司 2024-04-02 CN claimed
CN-114163780-B Epoxy resin composition and preparation method and application thereof 广东电网有限责任公司 2024-02-13 CN claimed
CN-116144303-B Underfill adhesive, preparation method thereof and chip packaging structure 广东粤港澳大湾区黄埔材料研究院 2024-02-13 CN claimed
CN-117510277-A Xylose residue-based coating material, preparation method thereof and coated controlled release fertilizer 华南农业大学 2024-02-06 CN claimed
CN-117467327-A Medium-low temperature curing high-temperature-resistant wave-absorbing material and preparation method thereof 航天特种材料及工艺技术研究所 2024-01-30 CN claimed
CN-117384111-A Preparation method of basalt fiber reinforced fireproof flame-retardant polymer matrix composite material 电子科技大学长三角研究院(湖州) 2024-01-12 CN claimed
CN-117247757-A Epoxy pouring sealant and preparation method and application thereof 珠海格力电器股份有限公司 2023-12-19 CN claimed
US-7005483-B2 Epoxy ebonite compositions 3L & T, INC. (US) 2006-02-28 US claimed
US-20040249044-A1 High temperature resistant coating composition 3L&T, INC. 2004-12-09 US claimed
US-20040143037-A1 Epoxy ebonite compositions 3L&T, INC. (US) 2004-07-22 US claimed
EP-0573573-B1 MESOGENIC GLYCIDYL AMINES DOW CHEMICAL CO (US) 1999-09-29 EP claimed
EP-0262891-B1 Resin composition of thermosetting resin and thermoplastic resin TOHO RAYON KK (JP) 1996-12-27 EP claimed
US-5342904-A Polymer modified adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties THE DOW CHEMICAL COMPANY (US) 1994-08-30 US claimed
EP-0573573-A1 MESOGENIC GLYCIDYL AMINES THE DOW CHEMICAL COMPANY (US) 1993-12-15 EP claimed
US-5235008-A Curable THE DOW CHEMICAL COMPANY (US) 1993-08-10 US claimed
WO-1992015630-A2 MESOGENIC GLYCIDYL AMINES THE DOW CHEMICAL COMPANY (US) 1992-09-17 WO claimed
EP-0262891-A2 Resin composition of thermosetting resin and thermoplastic resin Toho Rayon Co., Ltd. (JP) 1988-04-06 EP claimed