SCHEMBL562808

SCHEMBL562808

Cc1ccc(S(OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)(c2ccc(C)cc2)c2ccc(C)cc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CA1 P00915 14/20 0.46
CA2 P00918 14/20 0.46
GAA P10253 1/20 0.37
BCHE P06276 2/20 0.36
ACHE P22303 2/20 0.36
MMP1 P03956 1/20 0.36
MMP2 P08253 1/20 0.36
MMP9 P14780 1/20 0.36
MMP8 P22894 1/20 0.36
MMP13 P45452 1/20 0.36
ALDH1A1 P00352 2/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
AGER Q15109 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL271339 0.98 CA1 (0.44) CA1CA2GAABCHEACHE
SCHEMBL546899 0.94 CA1 (0.42) CA1CA2GAABCHEACHE
SCHEMBL3132983 0.94 CA1 (0.42) CA1CA2GAABCHEACHE
SCHEMBL3132826 0.94 CA1 (0.42) CA1CA2GAABCHEACHE
SCHEMBL3130060 0.94 CA1 (0.42) CA1CA2GAABCHEACHE
SCHEMBL1593302 0.94 CA2 (0.40) CA1CA2GAABCHEACHE
SCHEMBL219926 0.93 CA1 (0.41) CA1CA2GAABCHEACHE
SCHEMBL3129919 0.93 CA1 (0.41) CA1CA2GAABCHEACHE
SCHEMBL1593709 0.88 HSD11B1 (0.40) CA1CA2GAABCHEACHE
SCHEMBL563064 0.86 CA1 (0.45) CA1CA2GAABCHEACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8053158-B2 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-11-08 US claimed
US-20070202436-A1 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-08-30 US claimed
US-6033826-A POLYHYDROXYSTYRENE DERIVATIVE CONTAINING AN ACETAL OR KETAL GROUP WHICH CAN EASILY BE ELIMINATED IN THE PRESENCE OF AN ACID IN THE MOLECULE AND HAVING A VERY NARROW MOLECULAR WEIGHT DISTRIBUTION GIVES A RESIST MATERIAL WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2000-03-07 US claimed
US-8609013-B2 Method of fabricating a microfabricated structure SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-12-17 US disclosed
US-8580484-B2 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-11-12 US disclosed
EP-1942375-B1 Inkjet printer head comprising photosensitive polymer complex containing silver nanoparticles and method of preparing the photosensitive polymer complex SAMSUNG ELECTRONICS CO LTD (KR) 2013-02-27 EP disclosed
US-8383317-B2 Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; modifying surfaces of carbon nanotubes with polymerizable functional groups such as oxirane and anhydride groups; heat curing; negative patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-02-26 US disclosed
US-8211957-B2 Negative pattern of carbon nanotubes and carbon nanotube composite comprising surface-modified carbon nanotubes SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-07-03 US disclosed
US-20120034735-A1 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns LEE SANG KYUN (KR) 2012-02-09 US disclosed
US-8053158-B2 Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-11-08 US disclosed
US-7875416-B2 Composition for forming photosensitive polymer complex and method of preparing photosensitive polymer complex containing silver nanoparticles using the composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-01-25 US disclosed
US-6033826-A POLYHYDROXYSTYRENE DERIVATIVE CONTAINING AN ACETAL OR KETAL GROUP WHICH CAN EASILY BE ELIMINATED IN THE PRESENCE OF AN ACID IN THE MOLECULE AND HAVING A VERY NARROW MOLECULAR WEIGHT DISTRIBUTION GIVES A RESIST MATERIAL WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2000-03-07 US disclosed
EP-0704762-B1 Resist material and pattern formation WAKO PURE CHEM IND LTD (JP) 1999-12-15 EP disclosed
US-5976759-A ALKALI SOLUBLE BY HEATING WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1999-11-02 US disclosed
EP-0875787-A1 Method for reducing the substrate dependence of resist Wako Pure Chemical Industries, Ltd. (JP) 1998-11-04 EP disclosed
EP-0789279-A1 Polymer and resist material WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1997-08-13 EP disclosed
EP-0780732-A2 Polymer composition and resist material WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1997-06-25 EP disclosed
US-5558971-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
US-5558976-A HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1996-09-24 US disclosed
EP-0704762-A1 Resist material and pattern formation WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1996-04-03 EP disclosed