SCHEMBL563167

SCHEMBL563167

F[C]1CC2CCC1C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27731172 0.71 SLC6A3 (0.31)
SCHEMBL6858086 0.67
SCHEMBL27465096 0.67
SCHEMBL3537331 0.67
SCHEMBL21995884 0.67 SLC6A3 (0.33)
SCHEMBL482468 0.67
SCHEMBL21086749 0.67
SCHEMBL21332245 0.67
SCHEMBL9186090 0.67
SCHEMBL11342488 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024116576-A1 RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID-GENERATING AGENT JSR株式会社 2024-06-06 WO disclosed
WO-2024116577-A1 RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID GENERATOR JSR株式会社 2024-06-06 WO disclosed
WO-2024116575-A1 RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND RADIATION-SENSITIVE ACID GENERATOR JSR株式会社 2024-06-06 WO disclosed
US-20240126167-A1 RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN JSR CORPORATION (JP) 2024-04-18 US disclosed
WO-2024057751-A1 RADIOACTIVE-RAY-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR株式会社 2024-03-21 WO disclosed
WO-2024038865-A1 COMPOUND, COMPOSITION, SURFACE TREATMENT AGENT, COATING LIQUID, ARTICLE, AND ARTICLE MANUFACTURING METHOD AGC株式会社 2024-02-22 WO disclosed
WO-2024038866-A1 COMPOUND, COMPOSITION, SURFACE TREATMENT AGENT, COATING LIQUID, ARTICLE, AND METHOD FOR PRODUCING ARTICLE AGC株式会社 2024-02-22 WO disclosed
US-20240004297-A1 COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR CORPORATION (JP) 2024-01-04 US disclosed
US-20230400768-A1 RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN JSR CORPORATION (JP) 2023-12-14 US disclosed
US-20230400765-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ONIUM SALT COMPOUND JSR CORPORATION (JP) 2023-12-14 US disclosed
US-20140302438-A1 RESIST COMPOSITION, RESIST PATTERN-FORMING METHOD, AND RESIST SOLVENT JSR CORPORATION (JP) 2014-10-09 US disclosed
US-20140186771-A1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, COMPOUND, AND METHOD FOR PRODUCING COMPOUND JSR CORPORATION (JP) 2014-07-03 US disclosed
US-20140004463-A9 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER AND COMPOUND JSR CORPORATION (JP) 2014-01-02 US disclosed
US-8609318-B2 Radiation-sensitive resin composition, method for forming resist pattern and polymer JSR CORPORATION (JP) 2013-12-17 US disclosed
US-20130143160-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER AND COMPOUND JSR CORPORATION (JP) 2013-06-06 US disclosed
US-20130122426-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER AND COMPOUND JSR CORPORATION (JP) 2013-05-16 US disclosed
US-20130022912-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER AND COMPOUND JSR CORPORATION (JP) 2013-01-24 US disclosed
US-20120034560-A1 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND POLYMER JSR CORPORATION (JP) 2012-02-09 US disclosed
US-20090061360-A1 MATERIAL FOR RESIST PROTECTIVE FILM FOR IMMERSION LITHOGRAPHY ASAHI GLASS COMPANY, LIMITED (JP) 2009-03-05 US disclosed
EP-2009499-A1 MATERIAL OF THE RESIST-PROTECTING MEMBRANE FOR IMMERSION LITHOGRAPHY Asahi Glass Company, Limited (JP) 2008-12-31 EP disclosed