SCHEMBL564615

SCHEMBL564615

Nc1cc(Cc2ccc(O)c(N)c2)ccc1O

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 8/20 0.67
MAPT P10636 5/20 0.67
MEN1 O00255 3/20 0.67
KMT2A Q03164 3/20 0.67
KDM4E B2RXH2 2/20 0.67
POLB P06746 1/20 0.67
RAB9A P51151 1/20 0.67
CA1 P00915 2/20 0.61
CA2 P00918 2/20 0.61
CA4 P22748 1/20 0.61
CA6 P23280 1/20 0.61
ESR1 P03372 1/20 0.54
ESR2 Q92731 1/20 0.54
ALDH1A1 P00352 8/20 0.53
GFER P55789 1/20 0.53
ALOX15 P16050 4/20 0.50
HSD17B10 Q99714 4/20 0.50
ALOX12 P18054 3/20 0.50
HPGD P15428 3/20 0.50
IDH1 O75874 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29412587 1.00 GAA (0.67) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL29860720 1.00 GAA (0.67) GAAMAPTMEN1KMT2AKDM4E
Hydrochloric Acid SCHEMBL21173959 0.98 GAA (0.64) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL8514724 0.91 GAA (0.83) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL564633 0.91 ESR1 (0.58) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL565060 0.91 ALDH1A1 (0.58) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL29350695 0.89 IDH1 (0.68) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL564652 0.89 IDH1 (0.68) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL20132138 0.88 ALDH1A1 (0.61) GAAMAPTMEN1KMT2AKDM4E
SCHEMBL564946 0.88 KDM4E (0.53) GAAMAPTMEN1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 621 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4506753-A2 PHOTOSENSITIVE COMPOSITION Duksan Neolux Co., Ltd (KR) 2025-02-12 EP claimed
US-20250044690-A1 PHOTOSENSITIVE COMPOSITION Duksan Neolux Co., Ltd. (KR) 2025-02-06 US claimed
WO-2024216910-A1 HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF 明士(北京)新材料开发有限公司 2024-10-24 WO claimed
CN-118725295-A Resin, preparation method and application of resin 华为技术有限公司 2024-10-01 CN claimed
CN-118108661-B Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof 波米科技有限公司 2024-09-20 CN claimed
CN-115232017-B Compound, resin and preparation method and application thereof 华为技术有限公司 2024-06-18 CN claimed
CN-118108661-A Diamine monomer with nitrogen heterocycle and benzocyclobutene structure, and preparation method and application thereof 波米科技有限公司 2024-05-31 CN claimed
CN-114524938-B Polymer, photosensitive resin composition, cured film prepared from polymer and photosensitive resin composition, and electronic element 江苏三月科技股份有限公司 2024-02-09 CN claimed
CN-116836389-B Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-26 CN claimed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN claimed
CN-112175182-A Positive photosensitive polyesteramide resin and composition using same 明士(北京)新材料开发有限公司 2021-01-05 CN claimed
CN-111522201-A Positive photosensitive resin composition, cured film prepared from positive photosensitive resin composition and electronic element 江苏三月科技股份有限公司 2020-08-11 CN claimed
EP-3512905-A1 METHOD FOR PRODUCING A POLYBENZAZOL POLYMER (P) BASF SE (DE) 2019-07-24 EP claimed
CN-109181622-A A kind of highly heat-resistant polyimide insulating materials of low-temperature setting 浙江福斯特新材料研究院有限公司 2019-01-11 CN claimed
US-9975996-B2 Positive photosensitive resin composition and polyhydroxyamide resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-22 US claimed
WO-2018050489-A1 METHOD FOR PRODUCING A POLYBENZAZOL POLYMER (P) BASF SE (DE) 2018-03-22 WO claimed
US-20160185905-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND POLYHYDROXYAMIDE RESIN NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-06-30 US claimed
US-20120305484-A1 Thermally Rearranged (TR) Polymers as Membranes for Ethanol Dehydration BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (US) 2012-12-06 US claimed
WO-2012166153-A1 THERMALLY REARRANGED (TR) POLYMERS AS MEMBRANES FOR ETHANOL DEHYDRATION BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEMS (US) 2012-12-06 WO claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed