SCHEMBL565018

SCHEMBL565018

CC(=NO)C(C)[SiH3].CC(C)=NO.CC(C)=NO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28357740 0.94
SCHEMBL11321879 0.70
SCHEMBL202872 0.69 ALDH1A1 (0.38)
SCHEMBL22028071 0.69 ALDH1A1 (0.38)
SCHEMBL29048413 0.69
SCHEMBL564980 0.69
SCHEMBL8054304 0.69
SCHEMBL2206 0.69
SCHEMBL287484 0.67
SCHEMBL1268718 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 224 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024643-B2 Super-hydrophobic anti-pollution flashover coating with hydrophobicity migration, and preparation method thereof STATE GRID SHANDONG ELECTRIC POWER RESEARCH INSTITUTE (CN) 2024-07-02 US claimed
CN-116144314-B Sealant for single-component rapid deep curing photovoltaic module and preparation method thereof 湖北兴瑞硅材料有限公司 2024-03-12 CN claimed
CN-116144314-A Sealant for single-component rapid deep curing photovoltaic module and preparation method thereof 湖北兴瑞硅材料有限公司 2023-05-23 CN claimed
CN-114149783-A Low-temperature-resistant neutral silicone sealant and preparation method thereof 杭州之江有机硅化工有限公司 2022-03-08 CN claimed
EP-3034557-B1 THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE HENKEL AG & CO KGAA (DE) 2020-10-21 EP claimed
US-10160859-B2 Thermoplastic composition comprising a polyamide and a polysiloxane HENKEL AG & CO. KGAA (DE) 2018-12-25 US claimed
US-20170267862-A1 Thermoplastic Composition Comprising a Polyamide and a Polysiloxane HENKEL AG & CO. KGAA (DE) 2017-09-21 US claimed
WO-2016096305-A1 THERMOPLASTIC COMPOSITION COMPRISING A POLYAMIDE AND A POLYSILOXANE HENKEL AG & CO. KGAA (DE) 2016-06-23 WO claimed
EP-3034557-A1 Thermoplastic composition comprising a polyamide and a polysiloxane Henkel AG & Co. KGaA (DE) 2016-06-22 EP claimed
EP-1584648-B1 Organopolysiloxane composition for bonding to magnesium alloy SHINETSU CHEMICAL CO (JP) 2014-03-05 EP claimed
EP-1634928-B1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2007-10-31 EP claimed
US-7026426-B2 Room temperature curable organopolysiloxane compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-04-11 US claimed
EP-1035162-B1 RTV organopolysiloxane compositions SHINETSU CHEMICAL CO (JP) 2003-05-28 EP claimed
EP-0370643-B1 Organopolysiloxane composition curable to an elastomer and use thereof DOW CORNING GMBH (DE) 1995-12-27 EP claimed
US-5026812-A Organopolysiloxane composition curable to an elastomer and use thereof DOW CORNING GMBH (AT) 1991-06-25 US claimed
EP-0370643-A2 Organopolysiloxane composition curable to an elastomer and use thereof DOW CORNING GmbH (DE) 1990-05-30 EP claimed
JP-60026059-A None JP disclosed
JP-2189363-A None JP disclosed
US-4247442-A Mold and mildew resistant organopolysiloxane compositions TORAY SILICONE COMPANY, LTD. (JP) 1981-01-27 US disclosed
US-4191817-A POLYSILOXANE WITH AMINOALKYL GROUP, AMINOSILANE OR OXIMOSILANE WACKER-CHEMIE GMBH (DE) 1980-03-04 US disclosed