Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MMP2 | P08253 | 1/20 | 0.34 |
| ▸ | MMP9 | P14780 | 1/20 | 0.34 |
| ▸ | GCLC | P48506 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.32 |
| ▸ | AKR1A1 | P14550 | 1/20 | 0.32 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.32 |
| ▸ | HTR2A | P28223 | 1/20 | 0.32 |
| ▸ | HTR2C | P28335 | 1/20 | 0.32 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.32 |
| ▸ | HRH1 | P35367 | 1/20 | 0.32 |
| ▸ | DRD3 | P35462 | 1/20 | 0.32 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.32 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.32 |
| ▸ | HDAC2 | Q92769 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | SLC1A3 | P43003 | 1/20 | 0.31 |
| ▸ | SLC1A2 | P43004 | 1/20 | 0.31 |
| ▸ | SLC1A1 | P43005 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL890709 | 0.80 | CHRM1 (0.40) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL11855922 | 0.79 | CA1 (0.34) | CA2 | |
| SCHEMBL5022363 | 0.78 | CHRM1 (0.39) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL5013300 | 0.78 | CHRM1 (0.39) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL5014288 | 0.78 | CHRM1 (0.39) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL5014260 | 0.78 | CHRM1 (0.39) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL7241006 | 0.75 | CHRM1 (0.35) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL29029474 | 0.75 | PMP22 (0.35) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL5761 | 0.75 | PMP22 (0.35) | MMP2MMP9GCLCCA2MAPK1 | |
| SCHEMBL1634572 | 0.73 | MMP2 (0.35) | MMP2MMP9GCLCCA2MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8956523-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2015-02-17 | — | — | US | disclosed |
| US-20140081045-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-03-20 | — | — | US | disclosed |
| EP-1978134-B1 | Metal plating compositions | ROHM & HAAS ELECT MAT (US) | 2013-09-11 | — | — | EP | disclosed |
| US-8337688-B2 | Metal plating compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-12-25 | — | — | US | disclosed |
| US-8329018-B2 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-12-11 | — | — | US | disclosed |
| EP-1978051-B1 | Metal plating compositions and methods | ROHM & HAAS ELECT MAT (US) | 2012-02-22 | — | — | EP | disclosed |
| US-20120034371-A1 | METAL PLATING COMPOSITIONS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2012-02-09 | — | — | US | disclosed |
| US-20110318479-A1 | METAL PLATING COMPOSITIONS AND METHODS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-12-29 | — | — | US | disclosed |
| US-8048284-B2 | Mixture of metal compound and polyamideether copolymer; electrical or decorative article; printed circuits; improved leveling and throwing power | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-11-01 | — | — | US | disclosed |
| US-8012334-B2 | provide good leveling performance and throwing power; additives to improve the brightness, ductility and plating distribution of the metal deposit | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-09-06 | — | — | US | disclosed |
| US-20080269395-A1 | Metal plating compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-10-30 | — | — | US | disclosed |
| US-20080268138-A1 | Metal plating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-10-30 | — | — | US | disclosed |
| EP-1978051-A1 | Metal plating compositions and methods | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-10-08 | — | — | EP | disclosed |
| EP-1978134-A1 | Metal plating compositions | Rohm and Haas Electronic Materials LLC (US) | 2008-10-08 | — | — | EP | disclosed |
| US-20040104124-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2004-06-03 | — | — | US | disclosed |
| US-6736954-B2 | A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY | SHIPLEY COMPANY, L.L.C. | 2004-05-18 | — | — | US | disclosed |
| EP-1308540-A1 | Plating bath and method for depositing a metal layer on a substrate | Shipley Co. L.L.C. (US) | 2003-05-07 | — | — | EP | disclosed |
| US-20030070934-A1 | Plating bath and method for depositing a metal layer on a substrate | SHIPLEY COMPANY, L.L.C. | 2003-04-17 | — | — | US | disclosed |