SCHEMBL5667656

SCHEMBL5667656

O=C(O)c1ccc(-c2ccc(C(=O)O)c(C#Cc3ccccc3)c2)cc1C#Cc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 3/20 0.53
NPC1 O15118 2/20 0.50
RAB9A P51151 1/20 0.50
AKR1C2 P52895 1/20 0.49
AKR1C1 Q04828 1/20 0.49
ACMSD Q8TDX5 4/20 0.49
XDH P47989 1/20 0.46
SLC22A12 Q96S37 1/20 0.46
DHFR P00374 1/20 0.44
MCL1 Q07820 1/20 0.44
DCLRE1A Q6PJP8 1/20 0.44
DCLRE1B Q9H816 1/20 0.44
APP P05067 1/20 0.43
PTPRC P08575 1/20 0.42
PTPN2 P17706 1/20 0.42
PTPN1 P18031 1/20 0.42
PTPN6 P29350 1/20 0.42
PTPN9 P43378 1/20 0.42
DUSP3 P51452 1/20 0.42
PTPN11 Q06124 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2252034 0.86 BCL2L1 (0.50) HNF4AAKR1C2AKR1C1ACMSDXDH
SCHEMBL5667597 0.86 NPC1 (0.54) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL10623242 0.85 HNF4A (0.59) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL1713039 0.84 HNF4A (0.51) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL2254192 0.84 BCL2L1 (0.51) HNF4AAKR1C2AKR1C1ACMSDXDH
SCHEMBL10625329 0.83 HNF4A (0.58) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL27503365 0.82 HNF4A (0.46) HNF4ANPC1RAB9AACMSDDHFR
SCHEMBL2256468 0.81 NPC1 (0.72) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL29479413 0.81 NPC1 (0.72) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL5667285 0.80 KMO (0.50) HNF4AACMSDXDHSLC22A12DHFR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed