SCHEMBL5668907

SCHEMBL5668907

CC(C)(c1ccc(C(=O)O)c(C#Cc2ccccc2)c1)c1ccc(C(=O)O)c(C#Cc2ccccc2)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HNF4A P41235 1/20 0.46
NPC1 O15118 2/20 0.44
RAB9A P51151 1/20 0.44
RARB P10826 1/20 0.44
RARG P13631 1/20 0.44
AKR1C2 P52895 1/20 0.43
AKR1C1 Q04828 1/20 0.43
DHODH Q02127 1/20 0.39
PTPN1 P18031 2/20 0.38
CA12 O43570 1/20 0.37
CA2 P00918 1/20 0.37
CA9 Q16790 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
APP P05067 1/20 0.36
FFAR1 O14842 3/20 0.36
FFAR4 Q5NUL3 1/20 0.36
ALDH1A1 P00352 2/20 0.36
CYP3A4 P08684 2/20 0.36
ESR1 P03372 1/20 0.36
ESR2 Q92731 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5667739 0.88 NPC1 (0.47) HNF4ANPC1RAB9ARARBRARG
SCHEMBL5667656 0.79 HNF4A (0.53) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL10623242 0.78 HNF4A (0.59) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL1713039 0.78 HNF4A (0.51) HNF4ANPC1RAB9ARARBRARG
SCHEMBL5666966 0.78 TDP1 (0.41) RARBRARGAKR1C2AKR1C1TDP1
SCHEMBL10625329 0.77 HNF4A (0.58) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL5669819 0.76 HNF4A (0.63) HNF4ANPC1RAB9ARARBRARG
SCHEMBL2256468 0.75 NPC1 (0.72) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL29479413 0.75 NPC1 (0.72) HNF4ANPC1RAB9AAKR1C2AKR1C1
SCHEMBL5667707 0.74 TDP1 (0.41) RARBRARGTDP1FFAR1FFAR4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed