Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.48 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.48 |
| ▸ | CA3 | P07451 | 1/20 | 0.48 |
| ▸ | THRB | P10828 | 1/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.48 |
| ▸ | CA6 | P23280 | 1/20 | 0.48 |
| ▸ | CASP1 | P29466 | 1/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.48 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 5/20 | 0.41 |
| ▸ | CYP19A1 | P11511 | 3/20 | 0.40 |
| ▸ | ESR1 | P03372 | 2/20 | 0.40 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.40 |
| ▸ | APP | P05067 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | TP53 | P04637 | 3/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | GLA | P06280 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydroquinone SCHEMBL50263 | 0.90 | TSHR (0.48) | ALDH1A1HIF1ACYP3A4TSHRTDP1 | |
| SCHEMBL2898358 | 0.85 | ESR1 (0.44) | ALDH1A1HIF1ACYP3A4TSHRESR1 | |
| 4-Aminophenol SCHEMBL28675641 | 0.85 | SMN1; SMN2 (0.63) | ALDH1A1HIF1ACYP3A4CA3THRB | |
| Methane SCHEMBL28842587 | 0.83 | ESR1 (0.42) | ALDH1A1HIF1ACYP3A4TSHRESR1 | |
| P-Cresol SCHEMBL3682617 | 0.81 | ACHE (0.48) | ALDH1A1HIF1ACYP3A4THRBALOX15 | |
| SCHEMBL49595 | 0.81 | ESR1 (0.52) | ALDH1A1HIF1ACYP3A4TSHRESR1 | |
| SCHEMBL9328711 | 0.81 | ESR1 (0.52) | ALDH1A1TSHRESR1ESR2TDP1 | |
| SCHEMBL10439431 | 0.81 | TAAR1 (0.43) | ALDH1A1HIF1ACYP3A4TSHRAPP | |
| SCHEMBL14672966 | 0.81 | MEN1 (0.52) | ALDH1A1HIF1ACYP3A4TSHRESR1 | |
| Phenol SCHEMBL33409 | 0.81 | TDP1 (0.55) | ALDH1A1HIF1ACYP3A4CA3CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118344050-A | Artificial marble capable of being recycled and preparation method thereof | 华南理工大学 | 2024-07-16 | — | — | CN | claimed |
| CN-117820685-A | Method for preparing composite material by constructing high-temperature-resistant rigid-flexible structure with synergistic enhancement function on fiber surface | 大连理工大学 | 2024-04-05 | — | — | CN | claimed |
| CN-116496742-A | High-thixotropy adhesive for bonding multi-layer materials of deep-sea high-pressure container | 江苏科技大学 | 2023-07-28 | — | — | CN | claimed |
| CN-103642363-B | A kind of wear-resisting epoxy coating | JIANGXI HENGDA HI-TECH CO.,LTD. (CN) | 2015-11-18 | — | — | CN | claimed |
| CN-118344050-A | Artificial marble capable of being recycled and preparation method thereof | 华南理工大学 | 2024-07-16 | — | — | CN | disclosed |
| CN-117820685-A | Method for preparing composite material by constructing high-temperature-resistant rigid-flexible structure with synergistic enhancement function on fiber surface | 大连理工大学 | 2024-04-05 | — | — | CN | disclosed |
| CN-116496742-A | High-thixotropy adhesive for bonding multi-layer materials of deep-sea high-pressure container | 江苏科技大学 | 2023-07-28 | — | — | CN | disclosed |
| CN-116390967-A | Liquid resin composition and cured product thereof | 松下知识产权经营株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-113994256-A | Method for forming EUV patterned resist | 亚历克斯·P·G·罗宾逊 | 2022-01-28 | — | — | CN | disclosed |
| EP-1195083-B1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR ENGINEERING INC (JP) | 2006-01-11 | — | — | EP | disclosed |
| US-6881591-B2 | Underfilling material for semiconductor package | SUNSTAR SUISSE SA (CH) | 2005-04-19 | — | — | US | disclosed |
| US-20040112631-A1 | Underfilling material for semiconductor package | SUNSTAR GIKEN KABUSHIKI KAISHA | 2004-06-17 | — | — | US | disclosed |
| US-6660943-B1 | One-package type thermosetting urethane comprising prepolymer obtained by reacting polyol with excessive polyisocyanate; fine powder-coated curing agent; storage stability; low temperature curing | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2003-12-09 | — | — | US | disclosed |
| EP-1195083-A1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2002-04-10 | — | — | EP | disclosed |
| WO-2001005203-A1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2001-01-18 | — | — | WO | disclosed |