Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.34 |
| ▸ | THRB | P10828 | 1/20 | 0.33 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | NAAA | Q02083 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8734465 | 0.82 | ALDH1A1 (0.38) | TSHRALDH1A1HPGDATMHCAR2 | |
| SCHEMBL238944 | 0.82 | TSHR (0.43) | TSHRALDH1A1HPGDATMCES2 | |
| SCHEMBL17350179 | 0.81 | TSHR (0.42) | TSHRALDH1A1HPGDATMCES2 | |
| SCHEMBL8040583 | 0.79 | TSHR (0.41) | TSHRALDH1A1HPGDATMCES2 | |
| SCHEMBL8051943 | 0.79 | TSHR (0.33) | TSHRALDH1A1THRB | |
| SCHEMBL2209303 | 0.79 | THRB (0.38) | TSHRALDH1A1THRBTDP1 | |
| SCHEMBL20357559 | 0.74 | TSHR (0.51) | TSHRALDH1A1CES2THRBHCAR2 | |
| SCHEMBL1142187 | 0.73 | TSHR (0.42) | TSHRALDH1A1HPGDATMCES2 | |
| SCHEMBL17139823 | 0.72 | ALDH1A1 (0.43) | TSHRALDH1A1HPGDATMCES2 | |
| SCHEMBL25289740 | 0.72 | TSHR (0.41) | TSHRALDH1A1HPGDATMCES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0859403-B9 | Pressure sensitive adhesive composition for the polishing of the back of a wafer | LINTEC CORP (JP) | 2006-03-22 | — | — | EP | disclosed |
| EP-0859403-B1 | Pressure sensitive adhesive composition for the polishing of the back of a wafer | LINTEC CORP (JP) | 2005-11-16 | — | — | EP | disclosed |
| US-6255423-B1 | PRESSURE SENSITIVE ADHESIVE SHEET COMPRISING SUBSTRATE WITH SUPERIMPOSED ADHESIVE LAYER COMPRISING CARBOXYL GROUP CONTAINING COPOLYMER OBTAINED BY SOLUTION POLYMERIZATION, NEUTRALIZER CONTAINING NEITHER METAL NOR HALOGEN, CURING AGENT | LINTEC CORPORATION (JP) | 2001-07-03 | — | — | US | disclosed |
| US-6180742-B1 | CARBOXY COPOLYMER, NEUTRALIZER AND CROSSLINKER | LINTEC CORPORATION (JP) | 2001-01-30 | — | — | US | disclosed |
| US-6040048-A | BEAM CURABLE PRESSURE SENSITIVE ADHESIVE | LINTEC CORPORATION (JP) | 2000-03-21 | — | — | US | disclosed |
| EP-0899316-A1 | Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof | Lintec Corporation (JP) | 1999-03-03 | — | — | EP | disclosed |
| EP-0859403-A1 | Pressure sensitive adhesive composition for the polishing of the back of a wafer | Lintec Corporation (JP) | 1998-08-19 | — | — | EP | disclosed |