SCHEMBL17350179

SCHEMBL17350179

C=C(C)C(=O)N(CC)OCCCC

nearest known ligand 0.42

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.42
ALDH1A1 P00352 1/20 0.41
HPGD P15428 1/20 0.36
ATM Q13315 1/20 0.34
CES2 O00748 1/20 0.32
THRB P10828 1/20 0.32
HCAR2 Q8TDS4 1/20 0.31
TDP1 Q9NUW8 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20357559 0.93 TSHR (0.51) TSHRALDH1A1CES2THRBHCAR2
SCHEMBL8040583 0.87 TSHR (0.41) TSHRALDH1A1HPGDATMCES2
SCHEMBL5680958 0.81 TSHR (0.44) TSHRALDH1A1HPGDATMCES2
SCHEMBL17350614 0.80 THRB (0.35) TSHRALDH1A1THRB
SCHEMBL238944 0.79 TSHR (0.43) TSHRALDH1A1HPGDATMCES2
SCHEMBL17350254 0.74 TSHR (0.48) TSHRALDH1A1HPGDATMTHRB
SCHEMBL17350227 0.74 TSHR (0.38) TSHRALDH1A1THRB
SCHEMBL12534527 0.74 ALDH1A1 (0.37) TSHRALDH1A1THRBTDP1
SCHEMBL27543532 0.74 TSHR (0.39) TSHRALDH1A1HPGDATMCES2
SCHEMBL12534530 0.72 TSHR (0.39) TSHRALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2960314-B1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE FUJIMI INC (JP) 2024-06-26 EP disclosed
EP-3159915-B1 METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET FUJIMI INC (JP) 2023-12-06 EP disclosed
CN-110462797-B Polishing composition 福吉米株式会社 2023-09-22 CN disclosed
EP-3133638-B1 COMPOSITION FOR POLISHING SILICON WAFERS FUJIMI INC (JP) 2021-10-27 EP disclosed
CN-106463386-B Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2020-12-01 CN disclosed
EP-2957613-B1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INC (JP) 2020-11-18 EP disclosed
US-10745588-B2 Silicon wafer polishing composition FUJIMI INCORPORATED (JP) 2020-08-18 US disclosed
EP-3007213-B1 USE OF A COMPOSITION FOR SILICON WAFER POLISHING FUJIMI INC (JP) 2020-03-18 EP disclosed
WO-2020032173-A1 ACRYLIC COPOLYMER AND RUBBER MATERIAL 株式会社大阪ソーダ 2020-02-13 WO disclosed
EP-3605588-A1 POLISHING COMPOSITION Fujimi Incorporated (JP) 2020-02-05 EP disclosed
EP-3159915-A1 METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET Fujimi Incorporated (JP) 2017-04-26 EP disclosed
EP-3133638-A1 COMPOSITION FOR POLISHING SILICON WAFERS Fujimi Incorporated (JP) 2017-02-22 EP disclosed
EP-3133639-A1 COMPOSITION FOR POLISHING SILICON WAFERS Fujimi Incorporated (JP) 2017-02-22 EP disclosed
US-9566685-B2 Polishing composition and method for producing polished article FUJIMI INCORPORATED (JP) 2017-02-14 US disclosed
US-20160122591-A1 SILICON WAFER POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2016-05-05 US disclosed
EP-3007213-A1 COMPOSITION FOR SILICON WAFER POLISHING Fujimi Incorporated (JP) 2016-04-13 EP disclosed
US-20160001416-A1 POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INCORPORATED (JP) 2016-01-07 US disclosed
US-20150376464-A1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INCORPORATED (JP) 2015-12-31 US disclosed
EP-2960314-A1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE Fujimi Incorporated (JP) 2015-12-30 EP disclosed
EP-2957613-A1 POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE Fujimi Incorporated (JP) 2015-12-23 EP disclosed