SCHEMBL5705010

SCHEMBL5705010

C=Cc1ccc(C2([SiH3])CCCCO2)cc1

nearest known ligand 0.37

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28297581 0.98 ALDH1A1 (0.35) ALDH1A1
SCHEMBL28186420 0.86 ESR1 (0.32) ALDH1A1
SCHEMBL27514353 0.84 ESR1 (0.31) ALDH1A1
SCHEMBL10864816 0.83 ALDH1A1 (0.33) ALDH1A1
SCHEMBL28002080 0.81 CYP3A4 (0.33) ALDH1A1
SCHEMBL28120992 0.81
SCHEMBL643167 0.80 CYP3A4 (0.34) ALDH1A1
SCHEMBL25281081 0.79 SLC6A3 (0.42)
SCHEMBL2143236 0.79
SCHEMBL29222330 0.78 MAOB (0.41) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 70 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025000366-A1 SINGLE-COMPONENT HIGH-THERMAL-CONDUCTIVITY SILICONE MUD AND PREPARATION METHOD THEREFOR 江西天永诚高分子材料有限公司 2025-01-02 WO claimed
CN-115298573-B High refractive index silicone insert materials for embedded contact lenses 爱尔康公司 2024-09-06 CN claimed
CN-117612790-B High-current-carrying drag chain power servo cable and preparation method thereof 广州市新兴电缆实业有限公司 2024-07-02 CN claimed
CN-116554693-B Single-component high-heat-conductivity silicon mud and preparation method thereof 江西天永诚高分子材料有限公司 2024-06-11 CN claimed
CN-117612790-A High-current-carrying drag chain power servo cable and preparation method thereof 广州市新兴电缆实业有限公司 2024-02-27 CN claimed
CN-116587705-B High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2024-01-26 CN claimed
CN-117024746-A Hyperbranched polyester supercritical carbon dioxide thickener containing siloxane chain segments and preparation method thereof 西南石油大学 2023-11-10 CN claimed
CN-116855080-A Low-density flame-retardant organic silicon foam material and preparation method and application thereof 深圳先进技术研究院 2023-10-10 CN claimed
CN-113801452-B High-performance glass fiber reinforced PC material and product thereof 汉达精密电子(昆山)有限公司 2023-09-12 CN claimed
CN-116587705-A High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2023-08-15 CN claimed
CN-116554693-A Single-component high-heat-conductivity silicon mud and preparation method thereof 江西天永诚高分子材料有限公司 2023-08-08 CN claimed
CN-115298573-A High refractive index silicone insert materials for embedded contact lenses 爱尔康公司 2022-11-04 CN claimed
CN-115298574-A Embedded silicone hydrogel contact lenses 爱尔康公司 2022-11-04 CN claimed
EP-1543061-A1 METHOD OF PREPARING TRANSPARENT SILICONE-CONTAINING COPOLYCARBONATES GENERAL ELECTRIC COMPANY (US) 2005-06-22 EP claimed
US-6833422-B2 Interfacial polymerization of polycarbonates with polysiloxanes, then endcapping to form haze-free polycarbonatepolysiloxane copolymers GENERAL ELECTRIC COMPANY 2004-12-21 US claimed
WO-2004016674-A1 METHOD OF PREPARING TRANSPARENT SILICONE-CONTAINING COPOLYCARBONATES GENERAL ELECTRIC COMPANY (US) 2004-02-26 WO claimed
EP-0123560-B1 METHOD FOR FORMING FLATTENED FILM KABUSHIKI KAISHA TOSHIBA (JP) 1988-03-02 EP claimed
US-4510173-A Method for forming flattened film KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-09 US claimed
EP-0123560-A2 Method for forming flattened film KABUSHIKI KAISHA TOSHIBA (JP) 1984-10-31 EP claimed
CN-121343551-A Waterproof heat-conducting bonding pouring sealant and preparation method thereof 东莞市佳迪新材料有限公司 2026-01-16 CN disclosed
CN-119684793-A Organosilicon modified bismaleimide resin and preparation method and application thereof 广东盈骅新材料科技有限公司 2025-03-25 CN disclosed
WO-2025000366-A1 SINGLE-COMPONENT HIGH-THERMAL-CONDUCTIVITY SILICONE MUD AND PREPARATION METHOD THEREFOR 江西天永诚高分子材料有限公司 2025-01-02 WO disclosed
CN-115298573-B High refractive index silicone insert materials for embedded contact lenses 爱尔康公司 2024-09-06 CN disclosed
US-12074326-B2 Electrically conductive composite material and method DYNAMIC MATERIAL SYSTEMS LLC (US) 2024-08-27 US disclosed
CN-117612790-B High-current-carrying drag chain power servo cable and preparation method thereof 广州市新兴电缆实业有限公司 2024-07-02 CN disclosed
CN-113072072-B Silicon carbide material based on polysilocarb, application and device 帕里杜斯有限公司 2024-07-02 CN disclosed
CN-118221883-A Multilayer core-shell structure polymer and preparation method and application thereof 中化学科学技术研究有限公司 2024-06-21 CN disclosed
CN-116554693-B Single-component high-heat-conductivity silicon mud and preparation method thereof 江西天永诚高分子材料有限公司 2024-06-11 CN disclosed
CN-118043294-A SiC P-type and low resistivity crystals, boules, wafers and devices and methods of making the same 帕里杜斯有限公司 2024-05-14 CN disclosed
CN-117957635-A SiC P-type and low resistivity crystals, boules, wafers and devices and methods of making the same 帕里杜斯有限公司 2024-04-30 CN disclosed
CN-117916850-A SiC P-type and low resistivity crystals, boules, wafers and devices and methods of making the same 帕里杜斯有限公司 2024-04-19 CN disclosed
CN-117777449-A Method for preparing polysiloxane by phosphazene salt/strong alkali composite catalysis 青岛科技大学 2024-03-29 CN disclosed
CN-117795010-A Silicone polymer composition, cured product, electronic component, optical component, and composite member 捷恩智株式会社 2024-03-29 CN disclosed
CN-117612790-A High-current-carrying drag chain power servo cable and preparation method thereof 广州市新兴电缆实业有限公司 2024-02-27 CN disclosed
CN-116587705-B High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2024-01-26 CN disclosed
CN-116587705-B High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2024-01-26 CN disclosed
CN-117024746-A Hyperbranched polyester supercritical carbon dioxide thickener containing siloxane chain segments and preparation method thereof 西南石油大学 2023-11-10 CN disclosed
CN-117024746-A Hyperbranched polyester supercritical carbon dioxide thickener containing siloxane chain segments and preparation method thereof 西南石油大学 2023-11-10 CN disclosed
CN-116855080-A Low-density flame-retardant organic silicon foam material and preparation method and application thereof 深圳先进技术研究院 2023-10-10 CN disclosed
CN-113801452-B High-performance glass fiber reinforced PC material and product thereof 汉达精密电子(昆山)有限公司 2023-09-12 CN disclosed
CN-116587705-A High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2023-08-15 CN disclosed
CN-116587705-A High-heat-conductivity and high-heat-resistance composite substrate for printed circuit board and preparation method thereof 武汉中科先进材料科技有限公司 2023-08-15 CN disclosed
CN-116554693-A Single-component high-heat-conductivity silicon mud and preparation method thereof 江西天永诚高分子材料有限公司 2023-08-08 CN disclosed
CN-113801453-B Halogen-free flame-retardant transparent PC material and product thereof 汉达精密电子(昆山)有限公司 2023-05-16 CN disclosed
CN-115298573-A High refractive index silicone insert materials for embedded contact lenses 爱尔康公司 2022-11-04 CN disclosed
CN-115298574-A Embedded silicone hydrogel contact lenses 爱尔康公司 2022-11-04 CN disclosed
CN-113801453-A Halogen-free flame-retardant transparent PC material and product thereof 汉达精密电子(昆山)有限公司 2021-12-17 CN disclosed
CN-113801452-A High-performance glass fiber reinforced PC material and product thereof 汉达精密电子(昆山)有限公司 2021-12-17 CN disclosed
US-20210296652-A1 ELECTRICALLY CONDUCTIVE COMPOSITE MATERIAL AND METHOD DYNAMIC MATERIAL SYSTEMS LLC 2021-09-23 US disclosed
CN-110483783-B Preparation method of phenyl vinyl silicone resin HUBEI XINGRUI SILICON MATERIAL Co.,Ltd. (CN) 2021-08-31 CN disclosed
WO-2020018945-A1 ELECTRICALLY CONDUCTIVE COMPOSITE MATERIAL AND METHOD DYNAMIC MATERIAL SYSTEMS LLC (US) 2020-01-23 WO disclosed
CN-104744944-B Polysiloxanes based composition, solidfied material and optics 株式会社钟化 2017-12-19 CN disclosed
CN-105504833-A Single-component power-type organosilicon insulation paste for LED (light-emitting diode) packaging and preparation method thereof JIANG ZHUMING 2016-04-20 CN disclosed
CN-102268184-A Light-diffusing dimethyl organic silicone rubber composition and LED light-diffusing molding body 2011-12-07 CN disclosed
CN-101880396-B Preparation method of organic silicon rubber for encapsulating LED being convenient for vacuum defoamation UNIV HANGZHOU NORMAL 2011-11-23 CN disclosed
EP-1543061-B1 METHOD OF PREPARING TRANSPARENT SILICONE-CONTAINING COPOLYCARBONATES GEN ELECTRIC (US) 2006-08-30 EP disclosed
EP-1543061-A1 METHOD OF PREPARING TRANSPARENT SILICONE-CONTAINING COPOLYCARBONATES GENERAL ELECTRIC COMPANY (US) 2005-06-22 EP disclosed
US-6833422-B2 Interfacial polymerization of polycarbonates with polysiloxanes, then endcapping to form haze-free polycarbonatepolysiloxane copolymers GENERAL ELECTRIC COMPANY 2004-12-21 US disclosed
WO-2004016674-A1 METHOD OF PREPARING TRANSPARENT SILICONE-CONTAINING COPOLYCARBONATES GENERAL ELECTRIC COMPANY (US) 2004-02-26 WO disclosed
EP-0591784-B1 Use of grafted polyorganosiloxane products for the finishing of leather BAYER AG (DE) 1997-08-13 EP disclosed
US-5428067-A Surface modified inorganic, organic or polymeric support, covelantly bonded to anchor group while polymerized mixture of monomers and initiator bonded to anchor, and filling the free space of pores MACHEREY, NAGEL & CO. (DE) 1995-06-27 US disclosed
EP-0591784-A2 Use of grafted polyorganosiloxane products for the finishing of leather BAYER AG (DE) 1994-04-13 EP disclosed
EP-0425848-B1 Column packing material for gel permeation chromatography, process of preparation and use thereof MACHEREY NAGEL & CO CHEM (DE) 1994-02-02 EP disclosed
US-5164427-A Column-packing material for gel-permation chromatography method for preparation, and applications MACHEREY, NAGEL & CO. (DE) 1992-11-17 US disclosed
US-5091433-A COLUMN-PACKING MATERIAL FOR GEL-PERMATION CHROMATOGRAPHY, METHOD FOR ITS PREPARATION, AND APPLICATIONS MACHEREY, NAGEL & CO. (DE) 1992-02-25 US disclosed
EP-0425848-A1 Column packing material for gel permeation chromatography, process of preparation and use thereof MACHEREY, NAGEL & CO. (DE) 1991-05-08 EP disclosed
EP-0123560-B1 METHOD FOR FORMING FLATTENED FILM KABUSHIKI KAISHA TOSHIBA (JP) 1988-03-02 EP disclosed
US-4510173-A Method for forming flattened film KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-09 US disclosed
EP-0123560-A2 Method for forming flattened film KABUSHIKI KAISHA TOSHIBA (JP) 1984-10-31 EP disclosed
US-4055682-A RENDERING HYDROPHILIC A SILICONE WITH N-VINYLPYRROLIDONE, POLYMERIZATION HIGH VOLTAGE ENGINEERING CORPORATION (US) 1977-10-25 US disclosed
US-4055682-A RENDERING HYDROPHILIC A SILICONE WITH N-VINYLPYRROLIDONE, POLYMERIZATION HIGH VOLTAGE ENGINEERING CORPORATION (US) 1977-10-25 US disclosed