SCHEMBL5708444

SCHEMBL5708444

C=C(C)C(=O)OCC(COC(=O)C(=C)C)(COC(=O)C(=C)C)COC(=O)C(=C)C.C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C

nearest known ligand 0.58

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.58
TP53 P04637 3/20 0.58
HIF1A Q16665 3/20 0.58
CYP3A4 P08684 2/20 0.58
MAPK1 P28482 1/20 0.58
SMN1; SMN2 Q16637 1/20 0.58
THRB P10828 3/20 0.45
TSHR P16473 10/20 0.41
HPGD P15428 1/20 0.40
HSD17B10 Q99714 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11503487 1.00 ALDH1A1 (0.58) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL10148847 1.00 ALDH1A1 (0.58) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL26002233 0.95 ALDH1A1 (0.53) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL18567195 0.91 ALDH1A1 (0.73) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL64779 0.91 THRB (0.57) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL10430177 0.91 ALDH1A1 (0.73) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL8588391 0.91 ALDH1A1 (0.73) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL6473695 0.91 THRB (0.57) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL17938592 0.89 ALDH1A1 (0.55) ALDH1A1TP53HIF1ACYP3A4MAPK1
SCHEMBL11907305 0.89 ALDH1A1 (0.65) ALDH1A1TP53HIF1ACYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20060223690-A1 Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same E. I. DU PONT DE NEMOURS AND COMPANY 2006-10-05 US disclosed
EP-1708024-A2 Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same E.I.Du pont de nemours and company (US) 2006-10-04 EP disclosed
US-5451695-A Acrylic ester monomer with carbamate group, glazing for windows MITSUI TOATSU CHEMICALS, INC. (JP) 1995-09-19 US disclosed
US-4948700-A PHOTOPOLYMERIZABLE COMPOSITION OF EPOXY NOVOLAKS, UNSATURATED ACIS, POLYBASIC ANHYDRIDES, UNSATURATED ETHYLENIC COMPOUNDS, EPOXY COMPONENTS; CURING, MASHING, PRINTED CIRCUITS FUJI PHOTO FILM CO., LTD. (JP) 1990-08-14 US disclosed