Boric Acid

Boric Acid

SCHEMBL5724736

CCc1nc(C)c[nH]1.OB(O)O

nearest known ligand 0.34

Full drug profile on Sugi Atlas →

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ADORA1 P30542 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17688 0.91
SCHEMBL11854680 0.89
Bromide SCHEMBL8534627 0.89
Water SCHEMBL28756842 0.89
SCHEMBL11333696 0.89
Cyanate SCHEMBL5493626 0.88 ADORA1 (0.33) ADORA1
Water SCHEMBL28740273 0.87 ADORA1 (0.36) ADORA1
Water SCHEMBL28740272 0.87 ADORA1 (0.36) ADORA1
SCHEMBL6757150 0.85 ADORA1 (0.35) ADORA1
Acetic Acid SCHEMBL11221125 0.84 TP53 (0.33) ADORA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100366656-C Epoxy resin composition and method for producing heat-resistant laminate KAWAMURA INST CHEM RES (JP) 2008-02-06 CN disclosed
US-20060247334-A1 Epoxy resin composition and method for producing heat-resistant laminate sheet KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2006-11-02 US disclosed
CN-1829757-A Epoxy resin composition and method for producing heat-resistant laminate sheet KAWAMURA INST CHEM RES (JP) 2006-09-06 CN disclosed
EP-1652869-A1 EPOXY RESIN COMPOSITION AND METHOD FOR PRODUCING HEAT-RESISTANT LAMINATE SHEET KAWAMURA INSTITUTE OF CHEMICAL RESEARCH (JP) 2006-05-03 EP disclosed