⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL740446 | 0.74 | KDM4E (0.36) | — | |
| SCHEMBL1859933 | 0.74 | KDM4E (0.36) | — | |
| SCHEMBL740445 | 0.74 | KDM4E (0.36) | — | |
| SCHEMBL175503 | 0.72 | MAPK1 (0.35) | — | |
| SCHEMBL16005 | 0.72 | MAPK1 (0.35) | — | |
| SCHEMBL741406 | 0.70 | MAPK1 (0.37) | — | |
| SCHEMBL741407 | 0.70 | MAPK1 (0.37) | — | |
| SCHEMBL1860545 | 0.70 | MAPK1 (0.37) | — | |
| SCHEMBL11869383 | 0.66 | MAPK1 (0.31) | — | |
| SCHEMBL29784882 | 0.66 | MAPK1 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2468835-B1 | CATIONICALLY POLYMERIZABLE ADHESIVE AND POLARIZING PLATE OBTAINED USING SAME | DAINIPPON INK & CHEMICALS (JP) | 2019-01-02 | — | — | EP | claimed |
| EP-2468835-A1 | CATIONICALLY POLYMERIZABLE ADHESIVE AND POLARIZING PLATE OBTAINED USING SAME | DIC Corporation (JP) | 2012-06-27 | — | — | EP | claimed |
| WO-2021019784-A1 | RARE EARTH BONDED MAGNET COMPOUND AND METHOD FOR PRODUCING SAME, COMPACT AND METHOD FOR PRODUCING SAME, AND CURED MATERIAL | 昭和電工マテリアルズ株式会社 | 2021-02-04 | — | — | WO | disclosed |
| WO-2020225885-A1 | COMPOUND FOR RARE EARTH-BONDED MAGNET, RARE EARTH-BONDED MAGNET, METHOD FOR PRODUCING RARE EARTH-BONDED MAGNET, AND RESIN COMPOSITION | 昭和電工マテリアルズ株式会社 | 2020-11-12 | — | — | WO | disclosed |
| WO-2020225884-A1 | RESIN PARTICLE MIXTURE | 昭和電工マテリアルズ株式会社 | 2020-11-12 | — | — | WO | disclosed |
| EP-2468835-B1 | CATIONICALLY POLYMERIZABLE ADHESIVE AND POLARIZING PLATE OBTAINED USING SAME | DAINIPPON INK & CHEMICALS (JP) | 2019-01-02 | — | — | EP | disclosed |
| US-9773714-B2 | Semiconductor package resin composition and usage method thereof | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2017-09-26 | — | — | US | disclosed |
| US-9230873-B2 | Semiconductor package resin composition and usage method thereof | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2016-01-05 | — | — | US | disclosed |
| US-20150329740-A1 | Semiconductor Package Resin Composition and Usage Method Thereof | 3M INNOVATIVE PROPERTIES CO (US) | 2015-11-19 | — | — | US | disclosed |
| US-20140217622-A1 | Semiconductor Package Resin Composition and Usage Method Thereof | 3M INNOVATIVE PROPERTIES COMPANY | 2014-08-07 | — | — | US | disclosed |
| WO-2013012587-A2 | SEMICONDUCTOR PACKAGE RESIN COMPOSITION AND USAGE METHOD THEREOF | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2013-01-24 | — | — | WO | disclosed |
| EP-2468835-A1 | CATIONICALLY POLYMERIZABLE ADHESIVE AND POLARIZING PLATE OBTAINED USING SAME | DIC Corporation (JP) | 2012-06-27 | — | — | EP | disclosed |
| WO-2012018684-A1 | ENCAPSULATING RESIN COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2012-02-09 | — | — | WO | disclosed |