Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 6/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.33 |
| ▸ | FOLH1 | Q04609 | 4/20 | 0.33 |
| ▸ | TP53 | P04637 | 2/20 | 0.33 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | PTK2B | Q14289 | 1/20 | 0.31 |
| ▸ | HPGD | P15428 | 1/20 | 0.31 |
| ▸ | EP300 | Q09472 | 1/20 | 0.31 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.31 |
| ▸ | KAT5 | Q92993 | 1/20 | 0.31 |
| ▸ | KAT8 | Q9H7Z6 | 1/20 | 0.31 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9420515 | 0.88 | THRB (0.37) | THRBTSHRALDH1A1FOLH1KDM4E | |
| SCHEMBL8160907 | 0.85 | FOLH1 (0.35) | ALDH1A1FOLH1KDM4EKMT2APTK2B | |
| SCHEMBL472203 | 0.82 | POLB (0.38) | THRBTSHRALDH1A1FOLH1KDM4E | |
| SCHEMBL57853 | 0.82 | THRB (0.50) | THRBTSHRALDH1A1FOLH1TP53 | |
| SCHEMBL29612237 | 0.82 | THRB (0.50) | THRBTSHRALDH1A1FOLH1TP53 | |
| SCHEMBL587392 | 0.81 | TSHR (0.38) | THRBTSHRALDH1A1FOLH1 | |
| SCHEMBL28531604 | 0.80 | THRB (0.43) | THRBALDH1A1FOLH1TP53KDM4E | |
| SCHEMBL29629278 | 0.80 | THRB (0.48) | THRBTSHRALDH1A1FOLH1TP53 | |
| SCHEMBL3063751 | 0.80 | THRB (0.48) | THRBTSHRALDH1A1FOLH1TP53 | |
| SCHEMBL1898144 | 0.80 | PPARG (0.36) | THRBALDH1A1FOLH1KDM4EHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1270 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112969732-B | Photocurable resin composition, sealing material for fuel cell, cured product thereof, fuel cell, and sealing method | 三键有限公司 | 2023-11-28 | — | — | CN | claimed |
| US-11787931-B2 | Photocurable resin composition, sealing material for fuel cell, cured product thereof, fuel cell, and sealing method | THREEBOND CO., LTD. (JP) | 2023-10-17 | — | — | US | claimed |
| EP-3690993-B1 | COMPOSITIONS FOR FORMING A POROUS INSULATING LAYER, ELECTRODE FOR NON-AQUEOUS ELECTROLYTE RECHARGEABLE BATTERY, RECHARGEABLE BATTERY INCLUDING THE ELECTRODE AND METHOD OF MANUFACTURING THE ELECTRODE | SAMSUNG SDI CO LTD (KR) | 2023-10-04 | — | — | EP | claimed |
| EP-2740773-B2 | Curable pigment inkjet ink sets and methods for preparing the said ink sets | AGFA NV (BE) | 2022-10-05 | — | — | EP | claimed |
| CN-108027556-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel | 昭和电工材料株式会社 | 2022-05-06 | — | — | CN | claimed |
| US-20210403699-A1 | PHOTOCURABLE RESIN COMPOSITION, SEALING MATERIAL FOR FUEL CELL, CURED PRODUCT THEREOF, FUEL CELL, AND SEALING METHOD | THREEBOND CO., LTD. (JP) | 2021-12-30 | — | — | US | claimed |
| EP-3885380-A1 | PHOTOCURABLE RESIN COMPOSITION, SEALING MATERIAL FOR FUEL CELLS, CURED PRODUCT OF SAID PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT OF SAID SEALING MATERIAL FOR FUEL CELLS, FUEL CELL AND SEALING METHOD | ThreeBond Co., Ltd. (JP) | 2021-09-29 | — | — | EP | claimed |
| CN-112969732-A | Photocurable resin composition, sealing material for fuel cell, cured product of the same, fuel cell, and sealing method | 三键有限公司 | 2021-06-15 | — | — | CN | claimed |
| EP-2740773-B1 | Curable pigment inkjet ink sets and methods for preparing the said ink sets | AGFA NV (BE) | 2018-12-12 | — | — | EP | claimed |
| EP-2383314-B3 | Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate | FUJIFILM CORP (JP) | 2018-02-14 | — | — | EP | claimed |
| EP-2801594-B1 | Methods for preparing curable pigment inkjet ink sets | AGFA GRAPHICS NV (BE) | 2017-06-28 | — | — | EP | claimed |
| EP-2801594-A2 | Methods for preparing curable pigment inkjet ink sets | AGFA GRAPHICS NV (BE) | 2014-11-12 | — | — | EP | claimed |
| EP-2371911-B1 | Active radiation curable ink composition for inkjet recording, printed matter, method of manufacturing printed matter, molded article of printed matter, and method of manufacturing molded article of printed matter | FUJIFILM CORP (JP) | 2014-03-05 | — | — | EP | claimed |
| US-20140050768-A1 | Copper-Containing Metal Pigments with a Metal Oxide Layer and a Plastic Layer, Method for the Production Thereof, Coating Agent and Coated Object | ECKART GMBH (DE) | 2014-02-20 | — | — | US | claimed |
| EP-2383314-B1 | Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate | FUJIFILM CORP (JP) | 2012-12-26 | — | — | EP | claimed |
| EP-2103635-B1 | OIL-REPELLENT COPOLYMER, METHOD FOR PRODUCING THE SAME AND OIL-REPELLENT PROCESSING LIQUID | ASAHI GLASS CO LTD (JP) | 2012-09-12 | — | — | EP | claimed |
| EP-2289956-B1 | Oil-repellent copolymer, method for producing the same and oil-repellent processing liquid | ASAHI GLASS CO LTD (JP) | 2012-08-22 | — | — | EP | claimed |
| EP-2383314-A1 | Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate | Fujifilm Corporation (JP) | 2011-11-02 | — | — | EP | claimed |
| EP-1136538-B1 | USE OF A PHOTOCURABLE SEALING MATERIAL FOR OILY METAL SURFACES | NICHIBAN KK (JP) | 2006-10-18 | — | — | EP | claimed |
| US-6750277-B1 | IMPARTS HIGH WATER AND OIL REPELLENCY ONLY BY DRYING AT ROOM TEMPERATURE (0 TO 30 DEGREES C.) WITHOUT REQUIRING A HEAT TREATMENT STEP | DAIKIN INDUSTRIES LTD. (JP) | 2004-06-15 | — | — | US | claimed |