SCHEMBL577932

SCHEMBL577932

OC(Cl)CCCCCCCCCCC(O)Cl

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TRPV1 Q8NER1 1/20 0.36
TRPA1 O75762 1/20 0.36
GPR84 Q9NQS5 3/20 0.31
SPHK1 Q9NYA1 1/20 0.31
FFAR1 O14842 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18533315 0.88
SCHEMBL16970139 0.87 ALDH1A1 (0.36) TRPV1TRPA1
SCHEMBL16969901 0.87 ALDH1A1 (0.36) TRPV1TRPA1
SCHEMBL9912304 0.87 LMNA (0.36) TRPV1TRPA1GPR84FFAR1
SCHEMBL16970338 0.87
SCHEMBL27276486 0.87
SCHEMBL16970301 0.87 ALDH1A1 (0.36) TRPV1TRPA1
SCHEMBL16969830 0.87 ALDH1A1 (0.36) TRPV1TRPA1
SCHEMBL8097588 0.85 GPR84 (0.50) GPR84SPHK1FFAR1
SCHEMBL7868164 0.85 GPR84 (0.50) GPR84SPHK1FFAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100585-A1 CURABLE RESIN COMPOSITION, PREPREG, AND CURED PRODUCTS THEREOF 日本化薬株式会社 2026-05-15 WO disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed
EP-3604390-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS Shin-Etsu Chemical Co., Ltd. (JP) 2020-02-05 EP disclosed
EP-2417987-A2 Surface eroding sutures Tyco Healthcare Group LP (US) 2012-02-15 EP disclosed
US-20100323961-A1 SURFACE ERODING SUTURES TYCO HEALTHCARE GROUP LP (US) 2010-12-23 US disclosed