Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RPS6KA3 | P51812 | 1/20 | 0.59 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.58 |
| ▸ | RAB9A | P51151 | 6/20 | 0.57 |
| ▸ | NPC1 | O15118 | 4/20 | 0.57 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.57 |
| ▸ | MEN1 | O00255 | 1/20 | 0.57 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.57 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.57 |
| ▸ | GAA | P10253 | 7/20 | 0.56 |
| ▸ | MGAM | O43451 | 6/20 | 0.56 |
| ▸ | AMY1A | P0DUB6 | 6/20 | 0.56 |
| ▸ | SI | P14410 | 6/20 | 0.56 |
| ▸ | MGAM2 | Q2M2H8 | 6/20 | 0.56 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.56 |
| ▸ | MAPT | P10636 | 1/20 | 0.56 |
| ▸ | SLC9A1 | P19634 | 3/20 | 0.54 |
| ▸ | APAF1 | O14727 | 1/20 | 0.54 |
| ▸ | POLB | P06746 | 1/20 | 0.54 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.51 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.51 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9139443 | 0.94 | RPS6KA3 (0.56) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL23066417 | 0.89 | EGLN3 (0.60) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL688425 | 0.87 | KDM4E (0.57) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL438390 | 0.84 | MGAM (0.62) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL9143600 | 0.83 | RPS6KA3 (0.59) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL13604214 | 0.83 | RPS6KA3 (0.52) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL5550585 | 0.81 | RPS6KA3 (0.64) | RPS6KA3EGLN3RAB9ANPC1GAA | |
| SCHEMBL3403852 | 0.80 | SLC9A1 (0.63) | RPS6KA3EGLN3RAB9ANPC1GAA | |
| SCHEMBL29964193 | 0.80 | BCHE (0.49) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 | |
| SCHEMBL4685940 | 0.80 | MGAM (0.66) | RPS6KA3EGLN3RAB9ANPC1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | claimed |
| US-6270889-B1 | FOR MAKING PRINTED WIRING BOARDS | MITSUI MINING & SMELTING CO., LTD. (JP) | 2001-08-07 | — | — | US | claimed |
| EP-0930811-A1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-07-21 | — | — | EP | claimed |
| EP-2417841-B1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-01-30 | — | — | EP | disclosed |
| US-20120118753-A1 | Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-05-17 | — | — | US | disclosed |
| EP-2417841-A1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH Deutschland GmbH (DE) | 2012-02-15 | — | — | EP | disclosed |
| WO-2010115774-A1 | A METHOD OF MANUFACTURING A CIRCUIT CARRIER LAYER AND A USE OF SAID METHOD FOR MANUFACTURING A CIRCUIT CARRIER | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-10-14 | — | — | WO | disclosed |
| EP-0996318-B1 | Novel composite foil, process for producing the same and copper-clad laminate | MITSUI MINING & SMELTING CO (JP) | 2006-04-19 | — | — | EP | disclosed |
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | disclosed |
| EP-1176000-A1 | CARRIER FOIL-PASTED METAL FOIL AND PRODUCTION METHOD THEREOF | Mitsui Mining & Smelting Co., Ltd. (JP) | 2002-01-30 | — | — | EP | disclosed |
| US-20010019780-A1 | Metal foil with carrier and method for manufacturing the same | MITSUI MINING & SMELTING CO., LTD. | 2001-09-06 | — | — | US | disclosed |
| US-6270889-B1 | FOR MAKING PRINTED WIRING BOARDS | MITSUI MINING & SMELTING CO., LTD. (JP) | 2001-08-07 | — | — | US | disclosed |
| EP-0996318-A2 | Novel composite foil, process for producing the same and copper-clad laminate | Mitsui Mining & Smelting Co., Ltd. (JP) | 2000-04-26 | — | — | EP | disclosed |
| EP-0930811-A1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO., LTD. (JP) | 1999-07-21 | — | — | EP | disclosed |