Hydrochloric Acid

Hydrochloric Acid

SCHEMBL580650

CN(C)c1cc[n+](Cc2ccccc2)cc1.[Cl-]

nearest known ligand 0.96

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CHKA P35790 14/20 0.96
LMNA P02545 3/20 0.96
HTT P42858 3/20 0.96
SMN1; SMN2 Q16637 3/20 0.96
ALDH1A1 P00352 3/20 0.96
RAB9A P51151 2/20 0.57
NPC1 O15118 1/20 0.57
KDM4E B2RXH2 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1108048 0.98 CHKA (1.00) CHKALMNAHTTSMN1; SMN2ALDH1A1
Fluoride Ion SCHEMBL126023 0.94 CHKA (0.93) CHKALMNAHTTSMN1; SMN2ALDH1A1
Fluoride Ion SCHEMBL126024 0.94 CHKA (0.93) CHKALMNAHTTSMN1; SMN2ALDH1A1
SCHEMBL1108058 0.87 CHKA (1.00) CHKALMNAHTTSMN1; SMN2ALDH1A1
Hydrochloric Acid SCHEMBL19468736 0.83 CHKA (0.68) CHKALMNAHTTSMN1; SMN2ALDH1A1
SCHEMBL10062535 0.82 CHKA (0.96) CHKALMNAHTTSMN1; SMN2ALDH1A1
SCHEMBL14561873 0.81 CHKA (0.71) CHKALMNAHTTSMN1; SMN2ALDH1A1
Bromide SCHEMBL8857345 0.79 CHKA (0.71) CHKALMNAHTTSMN1; SMN2ALDH1A1
SCHEMBL10062537 0.79 CHKA (1.00) CHKALMNAHTTSMN1; SMN2ALDH1A1
SCHEMBL13851327 0.79 CHKA (0.71) CHKALMNAHTTSMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP claimed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US claimed
EP-0398358-A2 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-11-22 EP claimed
WO-2023241958-A1 A PROCESS FOR THE PHOTOLYTIC CHLORINATION OF HALOGENATED PYRIDINES WITH MOLECULAR CHLORINE BASF SE (DE) 2023-12-21 WO disclosed
EP-4293014-A1 A PROCESS FOR THE PHOTOLYTIC CHLORINATION OF HALOGENATED PYRIDINES WITH MOLECULAR CHLORINE BASF SE (DE) 2023-12-20 EP disclosed
EP-1307499-B2 CONTINUOUS PREPARATION OF POLYCARBONATE GEN ELECTRIC (US) 2012-02-15 EP disclosed
EP-1307499-B1 CONTINUOUS PREPARATION OF POLYCARBONATE GEN ELECTRIC (US) 2006-10-25 EP disclosed
US-6576739-B2 Conversion of the hindered bisphenol to the corresponding bischloroformate and subsequent treatment with an amine catalyst and an aqueous base to effect polymerization by hydrolysis and condenstation of bischloroformate groups GENERAL ELECTRIC COMPANY 2003-06-10 US disclosed
EP-1307499-A2 CONTINUOUS PREPARATION OF POLYCARBONATE GENERAL ELECTRIC COMPANY (US) 2003-05-07 EP disclosed
US-20020111456-A1 Method of polycarbonate preparation SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2002-08-15 US disclosed
US-20020035234-A1 Continuous preparation of polycarbonate GENERAL ELECTRIC COMPANY 2002-03-21 US disclosed
WO-2002008311-A2 CONTINUOUS PREPARATION OF POLYCARBONATE GENERAL ELECTRIC COMPANY (US) 2002-01-31 WO disclosed
WO-2001085825-A2 METHOD OF POLYCARBONATE PREPARATION GENERAL ELECTRIC COMPANY (US) 2001-11-15 WO disclosed
EP-0404188-B1 Non-aqueous electrolytic aluminum plating bath composition NISSHIN STEEL CO LTD (JP) 1994-03-16 EP disclosed
EP-0398358-B1 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO (JP) 1994-03-09 EP disclosed
US-5074973-A Mixed melt containing aluminum halide, nitrogen-heterocyclic halides, additives, organic polymer NISSHIN STEEL CO. LTD. (JP) 1991-12-24 US disclosed
US-5041194-A Using low melting mixture of aluminum halide and onium halide of nitrogen-containing compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1991-08-20 US disclosed
EP-0404188-A1 Non-aqueous electrolytic aluminum plating bath composition NISSHIN STEEL CO., LTD. (JP) 1990-12-27 EP disclosed
EP-0398358-A2 Aluminum electroplating method MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1990-11-22 EP disclosed