SCHEMBL5830399

SCHEMBL5830399

CCCCCO/C(CC)=C(\C)C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.52
TSHR P16473 4/20 0.47
ALDH1A1 P00352 2/20 0.47
HCAR2 Q8TDS4 2/20 0.46
EPHX1 P07099 1/20 0.44
THRB P10828 1/20 0.44
FNTA P49354 1/20 0.44
FNTB P49356 1/20 0.44
PGGT1B P53609 1/20 0.44
CES2 O00748 1/20 0.41
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
MAPK1 P28482 1/20 0.41
RAD52 P43351 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
FAAH O00519 1/20 0.40
LMNA P02545 1/20 0.40
ATM Q13315 1/20 0.39
CA12 O43570 1/20 0.39
CA1 P00915 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL125261 0.94 ALDH1A1 (0.54) NAAATSHRALDH1A1HCAR2EPHX1
SCHEMBL6065999 0.94 ALDH1A1 (0.54) NAAATSHRALDH1A1HCAR2EPHX1
SCHEMBL5167065 0.86 HCAR2 (0.41) NAAATSHRALDH1A1HCAR2THRB
SCHEMBL7758324 0.86 HCAR2 (0.41) NAAATSHRALDH1A1HCAR2THRB
SCHEMBL1898273 0.81 NAAA (0.53) NAAATSHRALDH1A1HCAR2EPHX1
SCHEMBL1898277 0.81 NAAA (0.53) NAAATSHRALDH1A1HCAR2EPHX1
SCHEMBL8982156 0.80 ACHE (0.36) TSHRALDH1A1THRBFNTAFNTB
SCHEMBL9717961 0.80 ALDH1A1 (0.48) TSHRALDH1A1LMNA
SCHEMBL1684988 0.78 NAAA (0.53) NAAATSHRALDH1A1HCAR2EPHX1
SCHEMBL21630432 0.78 TSHR (0.36) TSHRALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7101650-B2 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2006-09-05 US claimed
US-20040248030-A1 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2004-12-09 US claimed
WO-2003017001-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST DONGJIN SEMICHEM CO., LTD. (KR) 2003-02-27 WO claimed
CN-100557509-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2009-11-04 CN disclosed
CN-100445846-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2008-12-24 CN disclosed
US-7101650-B2 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2006-09-05 US disclosed
CN-1261822-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-06-28 CN disclosed
CN-1766732-A Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-05-03 CN disclosed
CN-1766719-A Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-05-03 CN disclosed
US-20040248030-A1 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2004-12-09 US disclosed
CN-1543591-A Photosensitive resin composition for photoresist 东进瑟弥侃株式会社 2004-11-03 CN disclosed
WO-2003017001-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST DONGJIN SEMICHEM CO., LTD. (KR) 2003-02-27 WO disclosed