Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX2 | P34913 | 5/20 | 0.36 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | NAAA | Q02083 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
| ▸ | PRKCA | P17252 | 3/20 | 0.32 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.31 |
| ▸ | ATM | Q13315 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15611830 | 0.96 | EPHX2 (0.40) | EPHX2MEN1KMT2ANAAACYP2D6 | |
| SCHEMBL15611567 | 0.95 | NAAA (0.41) | EPHX2MEN1KMT2ANAAALMNA | |
| SCHEMBL11755667 | 0.87 | CYP2D6 (0.36) | EPHX2KMT2ACYP2D6CYP2C19ALDH1A1 | |
| SCHEMBL11759558 | 0.87 | CYP2D6 (0.36) | EPHX2KMT2ACYP2D6CYP2C19ALDH1A1 | |
| SCHEMBL5837507 | 0.87 | CYP2D6 (0.36) | EPHX2KMT2ACYP2D6CYP2C19ALDH1A1 | |
| SCHEMBL5836998 | 0.82 | EPHX2 (0.34) | EPHX2CYP2D6CYP2C19ALDH1A1LMNA | |
| SCHEMBL5837477 | 0.82 | CYP2D6 (0.33) | EPHX2CYP2D6CYP2C19ALDH1A1HCAR2 | |
| SCHEMBL5837137 | 0.81 | CYP2D6 (0.35) | CYP2D6CYP2C19 | |
| SCHEMBL7638350 | 0.79 | CYP2D6 (0.39) | CYP2D6CYP2C19 | |
| SCHEMBL32688908 | 0.78 | CYP2D6 (0.38) | EPHX2CYP2D6CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110366704-B | Radiation-sensitive resin composition and electronic component | 日本瑞翁株式会社（JP） | 2023-01-13 | — | — | CN | disclosed |
| CN-111770964-B | Resin composition and electronic component | 日本瑞翁株式会社 | 2022-12-02 | — | — | CN | disclosed |
| CN-108885398-B | Radiation-sensitive resin composition and electronic component | 日本瑞翁株式会社 | 2022-11-29 | — | — | CN | disclosed |
| CN-114402258-A | Radiation-sensitive resin composition | 日本瑞翁株式会社 | 2022-04-26 | — | — | CN | disclosed |
| US-11169440-B2 | Radiation-sensitive resin composition and electronic component | ZEON CORPORATION (JP) | 2021-11-09 | — | — | US | disclosed |
| EP-3345970-B1 | RESIN COMPOSITION | ZEON CORP (JP) | 2021-07-28 | — | — | EP | disclosed |
| CN-107922742-B | Resin composition | 日本瑞翁株式会社 | 2021-01-15 | — | — | CN | disclosed |
| CN-107207868-B | Resin composition, resin film, and electronic component | 日本瑞翁株式会社 | 2020-11-06 | — | — | CN | disclosed |
| CN-111770964-A | Resin composition and electronic component | 日本瑞翁株式会社 | 2020-10-13 | — | — | CN | disclosed |
| US-10775697-B2 | Radiation-sensitive resin composition, resin film, and electronic device | ZEON CORPORATION (JP) | 2020-09-15 | — | — | US | disclosed |
| EP-3121652-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT | Zeon Corporation (JP) | 2017-01-25 | — | — | EP | disclosed |
| EP-3121651-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT | Zeon Corporation (JP) | 2017-01-25 | — | — | EP | disclosed |
| US-20170017155-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2017-01-19 | — | — | US | disclosed |
| US-20160297181-A1 | LAMINATE | ZEON CORPORATION (JP) | 2016-10-13 | — | — | US | disclosed |
| US-20160209744-A1 | RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2016-07-21 | — | — | US | disclosed |
| US-20160200914-A1 | RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20160202607-A1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE | ZEON CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-20140087136-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD | ZEON CORPORATION (JP) | 2014-03-27 | — | — | US | disclosed |
| US-7037993-B2 | Norbornene-based ring-opening polymerization polymer, product of hydrogenation of norbornene-based ring-opening polymerization polymer, and processes for producing these | ZEON CORPORATION (JP) | 2006-05-02 | — | — | US | disclosed |
| US-20050148746-A1 | Norbornene-based ring-opening polymerization polymer, product of hydrogenation of norbornene-based ring-opening polymerization polymer, and processes for producing these | ZEON CORPORATION (JP) | 2005-07-07 | — | — | US | disclosed |