SCHEMBL587108

SCHEMBL587108

C=COCCOc1cccc(C#N)c1

nearest known ligand 0.49

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TBXAS1 P24557 1/20 0.49
HRH1 P35367 1/20 0.40
CCR3 P51677 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.39
PPARG P37231 1/20 0.39
ICMT O60725 4/20 0.38
MAP4K4 O95819 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3426128 0.83 MAPK1 (0.43) SMN1; SMN2
SCHEMBL419321 0.83 MAPK1 (0.44) SMN1; SMN2
SCHEMBL19759480 0.83 TBXAS1 (0.50) TBXAS1HRH1CCR3SMN1; SMN2MAP4K4
SCHEMBL2908379 0.82 TBXAS1 (0.52) TBXAS1HRH1CCR3ICMT
SCHEMBL29996269 0.82 TBXAS1 (0.52) TBXAS1HRH1CCR3ICMT
SCHEMBL20552139 0.82 TBXAS1 (0.55) TBXAS1HRH1CCR3SMN1; SMN2PPARG
SCHEMBL586990 0.82 ALDH1A1 (0.51) TBXAS1HRH1SMN1; SMN2
SCHEMBL15282329 0.81 MAPK1 (0.43) SMN1; SMN2
SCHEMBL74120 0.80 TBXAS1 (0.54) TBXAS1HRH1CCR3SMN1; SMN2MAP4K4
SCHEMBL7388461 0.80 TBXAS1 (0.56) TBXAS1HRH1CCR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2078607-B1 PROCESS FOR PRODUCING A METAL FILM COATED MATERIAL, PROCESS FOR PRODUCING A METALLIC PATTERN BEARING MATERIAL AND USE OF A COMPOSITION FOR POLYMER LAYER FORMATION FUJIFILM CORP (JP) 2018-09-12 EP disclosed
EP-2236647-B1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM CORP (JP) 2018-02-21 EP disclosed
EP-2247171-B1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORP (JP) 2015-04-22 EP disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
EP-2105451-B1 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate FUJIFILM CORP (JP) 2012-02-15 EP disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
EP-2247171-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM Corporation (JP) 2010-11-03 EP disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
EP-2236647-A1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM Corporation (JP) 2010-10-06 EP disclosed
EP-2230328-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM Corporation (JP) 2010-09-22 EP disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
EP-2133200-A1 CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM Fujifilm Corporation (JP) 2009-12-16 EP disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
EP-2105451-A2 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate Fujifilm Corporation (JP) 2009-09-30 EP disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
EP-2078607-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE POLYMER, AND LAYERED PRODUCT FUJIFILM Corporation (JP) 2009-07-15 EP disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed