SCHEMBL58745

SCHEMBL58745

CCC1CC(CC2CCC(N)C(CC)C2)CCC1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10510279 0.92
SCHEMBL24139754 0.90 NOS3 (0.32)
SCHEMBL27824319 0.88 NOS3 (0.33)
SCHEMBL10509112 0.86 THRB (0.32)
SCHEMBL21065727 0.83 NOS1 (0.34)
SCHEMBL1201458 0.83 CYP1A2 (0.31)
SCHEMBL8850800 0.83 NOS1 (0.33)
SCHEMBL11121273 0.82
SCHEMBL927095 0.79 DPP4 (0.41)
SCHEMBL30358428 0.78 DPP4 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2039 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630661-B2 Additives useful in 3D printing technologies Evonik Operations GmbII (DE) 2026-05-19 US claimed
US-12522689-B2 Mannich base epoxy curative, cured epoxy resins thereof and methods of preparing the same JONES PAUL (GB) 2026-01-13 US claimed
EP-3592567-B1 PLASTIC MATERIAL FOR PRINTING BY DYE DIFFUSION THERMAL TRANSFER PRINTING EVONIK OPERATIONS GMBH (DE) 2025-11-19 EP claimed
EP-4251672-B1 POLYMERIC MANNICH BASE, PREPARATION METHODS AND USE AS AN EPOXY RESIN CURATIVE JONES PAUL (GB) 2025-09-24 EP claimed
US-12398269-B2 Method of manufacturing a mold that is resistant to hypochlorite EMS-CHEMIE AG (CH) 2025-08-26 US claimed
EP-4584333-A1 TWO COMPONENT COMPOSITION BASED ON A BLEND OF EPOXIDE COMPOUNDS Henkel AG & Co. KGaA (DE) 2025-07-16 EP claimed
US-20250207003-A1 TWO COMPONENT COMPOSITION BASED ON A BLEND OF EPOXIDE COMPOUNDS HENKEL AG & CO KGAA (DE) 2025-06-26 US claimed
US-12338322-B2 Photo-responsive dampening and toughening agents THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY (US) 2025-06-24 US claimed
CN-119998395-A Two-component composition based on epoxide mixtures 汉高股份有限及两合公司 2025-05-13 CN claimed
US-20250019579-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (FR) 2025-01-16 US claimed
US-20100048770-A1 CYCLOALIPHATIC POLYURETHANE COMPOSITION CONTAINING CYCLOALIPHATIC DIALDIMINES SIKA TECHNOLOGY AG (CH) 2010-02-25 US claimed
WO-2009156323-A2 POLYAMIDE MOULDED MASSES CONTAINING SEMI-CRYSTALLINE TRANSPARENT COPOLYAMIDES FOR PRODUCING HIGHLY FLEXIBLE TRANSPARENT MOULDED PARTS WITH HIGH NOTCH-IMPACT STRENGTH, LOW WATER ABSORBENCY AND EXCELLENT RESISTANCE TO CHEMICALS EMS-PATENT AG (CH) 2009-12-30 WO claimed
WO-2009132989-A2 POLYAMIDE MOULDING MATERIALS CONTAINING COPOLYAMIDES FOR PRODUCING TRANSPARENT MOULDING PARTS WITH LOW DISTORSION IN CLIMATIC TESTING EMS-PATENT AG (CH) 2009-11-05 WO claimed
US-20090105013-A1 ULTRAVIOLET LIGHT RESISTANT POLYMER COMPOSITIONS AND METHODS OF MAKING AND USING SLAGEL EDWIN CHARLES 2009-04-23 US claimed
EP-1975188-A1 Cycloaliphatic polyurethane compound containing cycloaliphatic dialdimines Sika Technology AG (CH) 2008-10-01 EP claimed
EP-1679329-B1 Curable composition KANEKA CORP (JP) 2007-12-19 EP claimed
US-20060173141-A1 Curable composition KANEKA CORPORATION (JP) 2006-08-03 US claimed
EP-1679329-A1 Curable composition KANEKA CORPORATION (JP) 2006-07-12 EP claimed
US-20050010022-A1 Epoxy resin compositions AIR PRODUCTS AND CHEMICALS, INC. 2005-01-13 US claimed
EP-1496075-A1 Epoxy resin compositions AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-01-12 EP claimed