SCHEMBL587580

SCHEMBL587580

C=CCC(OC(CC=C)c1cccc(C#N)c1)c1cccc(C#N)c1

nearest known ligand 0.36

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
DRD2 P14416 1/20 0.36
DRD3 P35462 1/20 0.36
TNF P01375 1/20 0.35
S1PR1 P21453 2/20 0.34
GRM4 Q14833 1/20 0.34
TACR1 P25103 1/20 0.34
MRGPRX1 Q96LB2 1/20 0.34
FFAR1 O14842 1/20 0.34
ENPP2 Q13822 1/20 0.34
MRGPRX4 Q96LA9 2/20 0.34
SLC6A2 P23975 2/20 0.34
SLC6A4 P31645 2/20 0.34
GLA P06280 1/20 0.34
GSK3B P49841 2/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
CNR1 P21554 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL587986 0.80 CYP19A1 (0.36)
SCHEMBL939842 0.74 CYP2C19 (0.50) SLC6A4SMN1; SMN2
SCHEMBL16955156 0.73 ENPP2 (0.40) DRD2DRD3TNFS1PR1GRM4
Methane SCHEMBL28626702 0.72 CYP2C19 (0.48) SLC6A4SMN1; SMN2
SCHEMBL18599259 0.71 SMN1; SMN2 (0.37) DRD2DRD3TNFS1PR1GRM4
SCHEMBL6163795 0.70 ENPP2 (0.46) TNFS1PR1GRM4ENPP2GSK3B
SCHEMBL13589661 0.70 S1PR1 (0.41) TNFS1PR1GRM4FFAR1ENPP2
SCHEMBL12322591 0.70 AOC3 (0.41) TNFS1PR1GRM4TACR1MRGPRX1
SCHEMBL4083138 0.69 ENPP2 (0.47) DRD2DRD3TNFS1PR1GRM4
SCHEMBL7514931 0.69 FFAR1 (0.47) DRD2TNFS1PR1GRM4TACR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2078607-B1 PROCESS FOR PRODUCING A METAL FILM COATED MATERIAL, PROCESS FOR PRODUCING A METALLIC PATTERN BEARING MATERIAL AND USE OF A COMPOSITION FOR POLYMER LAYER FORMATION FUJIFILM CORP (JP) 2018-09-12 EP disclosed
EP-2236647-B1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM CORP (JP) 2018-02-21 EP disclosed
EP-2247171-B1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORP (JP) 2015-04-22 EP disclosed
US-8632953-B2 Process for making lithographic printing plate FUJIFILM CORPORATION (JP) 2014-01-21 US disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
EP-2105451-B1 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate FUJIFILM CORP (JP) 2012-02-15 EP disclosed
US-20100279012-A1 METHOD FOR ADSORBING PLATING CATALYST, METHOD FOR PREPARING SUBSTRATE PROVIDED WITH METAL LAYER, AND PLATING CATALYST SOLUTION USED IN THE SAME FUJIFILM CORPORATION (JP) 2010-11-04 US disclosed
EP-2247171-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM Corporation (JP) 2010-11-03 EP disclosed
US-20100273014-A1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
US-20100272902-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM CORPORATION (JP) 2010-10-28 US disclosed
EP-2230328-A1 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID FUJIFILM Corporation (JP) 2010-09-22 EP disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
US-20100081090-A1 PROCESS FOR MAKING LITHOGRAPHIC PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
EP-2133200-A1 CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM Fujifilm Corporation (JP) 2009-12-16 EP disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
EP-2105451-A2 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate Fujifilm Corporation (JP) 2009-09-30 EP disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
EP-2078607-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE POLYMER, AND LAYERED PRODUCT FUJIFILM Corporation (JP) 2009-07-15 EP disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed