SCHEMBL5878486

SCHEMBL5878486

NC(=O)CCCCCCCCCCCCCCCCCc1ccccc1CCCCCCCCCCCCCCCCCC(N)=O

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 1/20 0.49
CYP4A11 Q02928 1/20 0.49
MAPT P10636 2/20 0.48
RXFP1 Q9HBX9 1/20 0.48
MPO P05164 2/20 0.47
TBXAS1 P24557 1/20 0.44
F13A1 P00488 3/20 0.44
L3MBTL1 Q9Y468 2/20 0.43
LMNA P02545 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
MTNR1A P48039 1/20 0.43
ALOX5 P09917 1/20 0.43
HDAC1 Q13547 1/20 0.43
HDAC2 Q92769 1/20 0.43
TLR8 Q9NR97 1/20 0.42
BID P55957 1/20 0.42
BCL2L1 Q07817 1/20 0.42
MCL1 Q07820 1/20 0.42
BAK1 Q16611 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29407477 1.00 CYP4F2 (0.49) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL517084 1.00 CYP4F2 (0.49) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL9395052 1.00 CYP4F2 (0.49) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL25711823 0.91 LIPG (0.56) CYP4F2CYP4A11TLR8BIDBCL2L1
SCHEMBL28055017 0.90 CYP4F2 (0.49) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL27754769 0.90 CYP4F2 (0.45) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL4685412 0.87 TAAR1 (0.50) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL27754704 0.86 MPO (0.44) CYP4F2CYP4A11MAPTRXFP1MPO
SCHEMBL9321175 0.84 MTNR1A (0.47) CYP4F2CYP4A11MPOLMNAMTNR1A
SCHEMBL18248549 0.84 MAPT (0.42) CYP4F2CYP4A11MAPTRXFP1MPO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116555938-A PLA fiber and nonwoven made therefrom 道达尔能源科碧恩私人有限公司 2023-08-08 CN disclosed
CN-105324434-A High thermal conductivity thermoplastic resin composition with excellent injection moldability KANEKA CORP 2016-02-10 CN disclosed
CN-102597344-B Fiber and fiber structure TEIJIN LTD 2015-05-13 CN disclosed
US-7056965-B2 Polyoxymethylene resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-06-06 US disclosed
US-7034102-B2 Polylactic acid resin composition and molded article thereof, and process of producing the molded article ASAHI DENKA CO., LTD. (JP) 2006-04-25 US disclosed
EP-1477526-A1 Polyactic acid resin composition and molded article thereof, and process of producing the molded article Asahi Denka Co., Ltd. (JP) 2004-11-17 EP disclosed
US-20040214983-A1 Polylactic acid resin composition and molded article thereof, and process of producing the molded article ASAHI DENKA CO., LTD (JP) 2004-10-28 US disclosed
US-20020183430-A1 Polyoxymethylene resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2002-12-05 US disclosed
EP-0568309-B1 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS (JP) 1997-07-16 EP disclosed
US-5502110-A ADDITION POLYMER BLENDS PREPARED WITH MULTIFUNCTIONAL PEROXIDE INITIATORS MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1996-03-26 US disclosed
EP-0568309-A2 Resin composition for electrophotographic toner MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-11-03 EP disclosed
US-4158729-A ORGANOALUMINUM COMPOUND ON AMIDE SUPPORT AS CATALYST MITSUBISHI CHEMICAL INDUSTRIES LTD. (JP) 1979-06-19 US disclosed