Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GAA | P10253 | 2/20 | 0.40 |
| ▸ | MGAM | O43451 | 1/20 | 0.40 |
| ▸ | SI | P14410 | 1/20 | 0.40 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.38 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.35 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.35 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.35 |
| ▸ | MMP8 | P22894 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 2/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9500498 | 0.86 | GAA (0.38) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL28737659 | 0.77 | TDP1 (0.35) | TDP1 | |
| SCHEMBL8822671 | 0.76 | PGD (0.35) | ALDH1A1CYP2C19ALOX15TSHRTDP1 | |
| SCHEMBL27696749 | 0.75 | MGAM (0.38) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL5692410 | 0.74 | MGAM (0.48) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL14790423 | 0.74 | MGAM (0.48) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL2943133 | 0.74 | MGAM (0.48) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL18050802 | 0.73 | ALOX15 (0.48) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL13602465 | 0.72 | GAA (0.46) | GAAMGAMSIMGAM2ALDH1A1 | |
| SCHEMBL4822087 | 0.72 | GAA (0.41) | GAAMGAMSIMGAM2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6607795-B1 | Polyamides, polyesters, polyethers, polyamines, and/or polyurethanes; transition metal oxidation catalyst and photoinitiator | CHEVRON PHILLIPS CHEMICAL COMPANY LP | 2003-08-19 | — | — | US | claimed |
| US-20030144145-A1 | OXYGEN SCAVENGING COMPOSITIONS COMPRISING POLYMERS DERIVED FROM AROMATIC DIFUNCTIONAL MONOMERS | CRYOVAC, INC. | 2003-07-31 | — | — | US | claimed |
| WO-2003053171-A2 | OXYGEN SCAVENGING COMPOSITIONS COMPRISING POLYMERS DERIVED FROM AROMATIC DIFUNCTIONAL MONOMERS | CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) | 2003-07-03 | — | — | WO | claimed |
| US-6498200-B1 | OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM | NAMICS CORPORATION (JP) | 2002-12-24 | — | — | US | claimed |
| WO-2024111333-A1 | INSULATIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2024-05-30 | — | — | WO | disclosed |
| CN-117957068-A | Method for discharging resin composition, method for manufacturing electronic component, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117957270-A | Resin composition for injection dispensing, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-30 | — | — | CN | disclosed |
| CN-117940488-A | Resin composition, adhesive for electronic component, cured product thereof, and electronic component | 纳美仕有限公司 | 2024-04-26 | — | — | CN | disclosed |
| EP-3747933-B1 | RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | NAMICS CORP (JP) | 2023-06-07 | — | — | EP | disclosed |
| EP-3747933-A1 | RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2020-12-09 | — | — | EP | disclosed |
| US-20200347227-A1 | RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | NAMICS CORPORATION (JP) | 2020-11-05 | — | — | US | disclosed |
| CN-111527130-A | Resin composition, cured product thereof, adhesive, semiconductor device, and electronic component | 纳美仕有限公司 | 2020-08-11 | — | — | CN | disclosed |
| US-6746622-B2 | MIXTURES OF ADDITION POLYMERS SUCH AS POLYTETRAHYDOFURFURYL METHACRYLATE AND OXIDATION CATALYSTS USED FOR PACKAGING FOOD, BEVERAGES OR DRUGS; STORAGE STABILITY | CHEVRON PHILLIPS CHEMICAL COMPANY LP | 2004-06-08 | — | — | US | disclosed |
| WO-2003068888-A2 | OXYGEN SCAVENGING COMPOSITIONS COMPRISING POLYMERS DERIVED FROM BENZENEDIMETHANOL MONOMERS | CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) | 2003-08-21 | — | — | WO | disclosed |
| US-6607795-B1 | Polyamides, polyesters, polyethers, polyamines, and/or polyurethanes; transition metal oxidation catalyst and photoinitiator | CHEVRON PHILLIPS CHEMICAL COMPANY LP | 2003-08-19 | — | — | US | disclosed |
| US-20030153644-A1 | Oxygen scavenging compositions comprising polymers derived from tetrahydrofurfuryl monomers | CRYOVAC, INC. | 2003-08-14 | — | — | US | disclosed |
| US-20030151025-A1 | Oxygen scavenging compositions comprising polymers derived from benzenedimethanol monomers | CRYOVAC, INC. | 2003-08-14 | — | — | US | disclosed |
| US-20030144145-A1 | OXYGEN SCAVENGING COMPOSITIONS COMPRISING POLYMERS DERIVED FROM AROMATIC DIFUNCTIONAL MONOMERS | CRYOVAC, INC. | 2003-07-31 | — | — | US | disclosed |
| WO-2003053171-A2 | OXYGEN SCAVENGING COMPOSITIONS COMPRISING POLYMERS DERIVED FROM AROMATIC DIFUNCTIONAL MONOMERS | CHEVRON PHILLIPS CHEMICAL COMPANY LP (US) | 2003-07-03 | — | — | WO | disclosed |
| US-6498200-B1 | OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM | NAMICS CORPORATION (JP) | 2002-12-24 | — | — | US | disclosed |