SCHEMBL588584

SCHEMBL588584

CCCCC#C[Si](C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
HMGCR P04035 3/20 0.34
PTPN7 P35236 5/20 0.32
LMNA P02545 1/20 0.32
KDM4E B2RXH2 1/20 0.30
MEN1 O00255 1/20 0.30
USP2 O75604 1/20 0.30
ALDH1A1 P00352 1/20 0.30
POLB P06746 1/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30
ALOX12 P18054 1/20 0.30
RECQL P46063 1/20 0.30
BLM P54132 1/20 0.30
KMT2A Q03164 1/20 0.30
MCL1 Q07820 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2121918 0.92 PTPN7 (0.40) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL9628541 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL3796995 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL3796992 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL31519146 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL9336077 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL5865499 0.90 PTPN7 (0.43) TSHRHMGCRPTPN7KDM4EMEN1
SCHEMBL16420274 0.85 RAB9A (0.33) LMNA
Oxalic Acid SCHEMBL5367389 0.83 HMGCR (0.38) HMGCRPTPN7KDM4EMEN1USP2
SCHEMBL734583 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11814462-B2 Functionalized cyclic polymers and methods of preparing same UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. (US) 2023-11-14 US claimed
US-20220056167-A1 Functionalized Cyclic Polymers and Methods of Preparing Same NATIONAL SCIENCE FOUNDATION 2022-02-24 US claimed
WO-2020223672-A1 FUNCTIONALIZED CYCLIC POLYMERS AND METHODS OF PREPARING SAME UNIVERSITY OF FLORIDA RESEARCHFOUNDATION, INC. (US) 2020-11-05 WO claimed
US-6436824-B1 Low dielectric constant materials for copper damascene CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SG) 2002-08-20 US claimed
US-11814462-B2 Functionalized cyclic polymers and methods of preparing same UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. (US) 2023-11-14 US disclosed
US-20220056167-A1 Functionalized Cyclic Polymers and Methods of Preparing Same NATIONAL SCIENCE FOUNDATION 2022-02-24 US disclosed
WO-2020223672-A1 FUNCTIONALIZED CYCLIC POLYMERS AND METHODS OF PREPARING SAME UNIVERSITY OF FLORIDA RESEARCHFOUNDATION, INC. (US) 2020-11-05 WO disclosed
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 EP disclosed
US-8816114-B2 Method for manufacturing ruthenium carbene complexes EVONIK DEGUSSA GMBH (DE) 2014-08-26 US disclosed
US-20130338370-A1 METHOD FOR MANUFACTURING RUTHENIUM CARBENE COMPLEXES EVONIK DEGUSSA GMBH (DE) 2013-12-19 US disclosed
WO-2013159135-A1 DISPERSION INK SEPIAX INK TECHNOLOGY GMBH (AT) 2013-10-31 WO disclosed
US-8501975-B2 Method for manufacturing ruthenium carbene complexes EVONIK DEGUSSA GMBH (DE) 2013-08-06 US disclosed
US-6887649-B2 Multi-layered resist structure and manufacturing method of semiconductor device FUJITSU LIMITED (JP) 2005-05-03 US disclosed
US-20030225232-A1 Hyperbranched polymers HONG KONG UNIVERSITY OF SCIENCE & TECHNOLOGY, THE (HK) 2003-12-04 US disclosed
US-20030035917-A1 Image making medium HYMAN SYDNEY (US) 2003-02-20 US disclosed
US-6506537-B2 Photopolymerization JSR CORPORATION (JP) 2003-01-14 US disclosed
US-20020192595-A1 Multi-layered resist structure and manufacturing method of semiconductor device FUJITSU LIMITED (JP) 2002-12-19 US disclosed
US-6436824-B1 Low dielectric constant materials for copper damascene CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SG) 2002-08-20 US disclosed
US-20020012872-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-31 US disclosed
EP-1164433-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed