⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL108162 | 0.91 | — | — | |
| SCHEMBL33512 | 0.91 | — | — | |
| SCHEMBL976741 | 0.83 | — | — | |
| SCHEMBL11497420 | 0.83 | — | — | |
| SCHEMBL3177763 | 0.83 | — | — | |
| SCHEMBL2471032 | 0.83 | — | — | |
| SCHEMBL1774050 | 0.83 | — | — | |
| SCHEMBL11059242 | 0.83 | — | — | |
| SCHEMBL238037 | 0.83 | — | — | |
| SCHEMBL2122361 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110246766-A | A kind of fan-out packaging structure and its manufacturing method | 上海先方半导体有限公司 | 2019-09-17 | — | — | CN | claimed |
| CN-104465764-B | Semiconductor element and the method for manufacturing semiconductor element | 美格纳半导体有限公司 | 2019-09-13 | — | — | CN | claimed |
| CN-103975001-B | Prepare the method and its application of CMP composition | 巴斯夫欧洲公司 | 2017-09-01 | — | — | CN | claimed |
| CN-205159322-U | MOSFET (metal -oxide -semiconductor field effect transistor) device | SUNNYCHIP SEMICONDUCTOR COMPANY | 2016-04-13 | — | — | CN | claimed |
| US-5627400-A | Semiconductor memory device | NEC CORPORATION (JP) | 1997-05-06 | — | — | US | claimed |
| JP-59232446-A | — | — | None | — | — | JP | disclosed |
| JP-4206972-A | — | — | None | — | — | JP | disclosed |
| CN-110534420-A | The method of semiconductor device and production semiconductor device | TAIWAN SEMICONDUCTOR MFG CO LTD | 2019-12-03 | — | — | CN | disclosed |
| CN-110504261-A | IC apparatus | TAIWAN SEMICONDUCTOR MFG CO LTD | 2019-11-26 | — | — | CN | disclosed |
| CN-110473919-A | Semiconductor structure, high electron mobility transistor and semiconductor structure manufacturing method | VANGUARD INT SEMICONDUCT CORP | 2019-11-19 | — | — | CN | disclosed |
| CN-110416159-A | The method for forming semiconductor structure | TAIWAN SEMICONDUCTOR MFG CO LTD | 2019-11-05 | — | — | CN | disclosed |
| CN-110265390-A | Semiconductor devices | 英飞凌科技股份有限公司 | 2019-09-20 | — | — | CN | disclosed |
| CN-205159322-U | MOSFET (metal -oxide -semiconductor field effect transistor) device | SUNNYCHIP SEMICONDUCTOR COMPANY | 2016-04-13 | — | — | CN | disclosed |
| CN-1550288-B | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method | JSR CORP | 2010-05-05 | — | — | CN | disclosed |
| US-7132722-B2 | Physical quantity sensor | YAMAHA CORPORATION (JP) | 2006-11-07 | — | — | US | disclosed |
| US-20050194651-A1 | Physical quantity sensor | YAMAHA CORPORATION (JP) | 2005-09-08 | — | — | US | disclosed |
| CN-1550288-A | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method | JSR��ʽ���� | 2004-12-01 | — | — | CN | disclosed |
| US-5627400-A | Semiconductor memory device | NEC CORPORATION (JP) | 1997-05-06 | — | — | US | disclosed |
| JP-H04206972-A | SEMICONDUCTOR DEVICE | NEC CORP | 1992-07-28 | — | — | JP | disclosed |
| JP-S59232446-A | SEMICONDUCTOR DEVICE | NEC CORP | 1984-12-27 | — | — | JP | disclosed |