SCHEMBL5887748

SCHEMBL5887748

c1ccc2c(c1)c1c3ccccc3c1c1c3ccccc3c21

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.50
HSD17B10 Q99714 5/20 0.50
CYP1A2 P05177 5/20 0.50
HPGD P15428 2/20 0.50
THRB P10828 1/20 0.50
CYP2A6 P11509 3/20 0.44
TSHR P16473 2/20 0.44
TDP1 Q9NUW8 1/20 0.44
IDO1 P14902 1/20 0.41
GPR3 P46089 4/20 0.39
HPRT1 P00492 1/20 0.39
MAPK1 P28482 2/20 0.38
HIF1A Q16665 2/20 0.38
ERBB2 P04626 1/20 0.38
FYN P06241 1/20 0.38
MAOA P21397 1/20 0.38
ACHE P22303 1/20 0.38
AHR P35869 1/20 0.38
CASP1 P29466 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30951774 0.91 ALDH1A1 (0.59) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL184685 0.91 ALDH1A1 (0.50) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL29373271 0.91 ALDH1A1 (0.59) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL29858302 0.91 ALDH1A1 (0.50) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL262425 0.91 ALDH1A1 (0.59) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL30019255 0.91 ALDH1A1 (0.50) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL712459 0.91 ALDH1A1 (0.59) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL5471846 0.89 HSD17B10 (0.50) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL11302617 0.89 CYP1A2 (0.58) ALDH1A1HSD17B10CYP1A2HPGDTHRB
SCHEMBL5471214 0.89 CYP1A2 (0.58) ALDH1A1HSD17B10CYP1A2HPGDTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240213072-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-27 US disclosed
US-20240199918-A1 ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING PROCESSED SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
EP-4317339-A1 ADHESIVE COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING PROCESSED SUBSTRATE Nissan Chemical Corporation (JP) 2024-02-07 EP disclosed
EP-4309893-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
EP-4310157-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
WO-2023074324-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE 日産化学株式会社 2023-05-04 WO disclosed
EP-2868726-B1 Ephemeral bonding ROHM & HAAS ELECT MAT (US) 2019-02-20 EP disclosed
EP-2933301-B1 ADHESION PROMOTER ROHM & HAAS ELECT MAT (US) 2018-04-25 EP disclosed
US-9909040-B2 Ephemeral bonding ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-03-06 US disclosed
WO-1997010193-A9 ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF THE DOW CHEMICAL COMPANY (US) 2018-02-08 WO disclosed
US-20140120242-A1 ADHESION PROMOTER ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-05-01 US disclosed
EP-2725605-A2 Temporary wafer bonding Rohm and Haas Electronic Materials LLC (US) 2014-04-30 EP disclosed
US-6998148-B1 Porous materials SHIPLEY COMPANY, L.L.C. (US) 2006-02-14 US disclosed
US-20050255710-A1 Porous materials SHIPLEY COMPANY, L.L.C. (US) 2005-11-17 US disclosed
US-6399666-B1 FOR MICROCIRCUIT; DECOMPOSABLE POLYMER AND DIELECTRIC INTERNATIONAL BUSINESS MACHINES CORPORATION 2002-06-04 US disclosed
EP-0854849-B1 ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF DOW CHEMICAL CO (US) 2001-10-31 EP disclosed
US-6121495-A Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof THE DOW CHEMICAL COMPANY (US) 2000-09-19 US disclosed
US-6093636-A FORMING ON A SUBSTRATE A DIELECTRIC LAYER COMPRISING DECOMPOSABLE POLYMER AND THERMOSETTING RESIN; HEATING TO CURE THE THERMOSETTING RESIN; DECOMPOSING THE DECOMPOSABLE POLYMER; LITOGRAPHIC PATTERNING; DEPOSITING A METALLIC FILM INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2000-07-25 US disclosed
EP-0854849-A1 ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF THE DOW CHEMICAL COMPANY (US) 1998-07-29 EP disclosed
WO-1997010193-A1 ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF THE DOW CHEMICAL COMPANY (US) 1997-03-20 WO disclosed