SCHEMBL5906873

SCHEMBL5906873

Nc1nc(N)nc(NCNc2nc(N)nc(N)n2)n1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.42
CA2 P00918 3/20 0.42
CA9 Q16790 3/20 0.42
NPSR1 Q6W5P4 1/20 0.38
CASP1 P29466 1/20 0.38
GPR68 Q15743 5/20 0.35
HTR1A P08908 4/20 0.34
DRD2 P14416 3/20 0.34
HTR2A P28223 3/20 0.34
HTR7 P34969 3/20 0.34
HTR6 P50406 3/20 0.34
CA12 O43570 1/20 0.32
CYP1A2 P05177 1/20 0.32
ADORA2A P29274 1/20 0.32
HTR2B P41595 1/20 0.32
NPC1 O15118 2/20 0.31
RAB9A P51151 2/20 0.31
KDM4E B2RXH2 1/20 0.31
LMNA P02545 1/20 0.31
NFKB1 P19838 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13993369 0.86 CA1 (0.36) CA1CA2CA9NPSR1CASP1
SCHEMBL380440 0.82 CA1 (0.47) CA1CA2CA9NPSR1CASP1
SCHEMBL15294300 0.80 CA1 (0.41) CA1CA2CA9NPSR1CASP1
SCHEMBL183472 0.78 LMNA (0.52) CYP1A2NPC1RAB9AKDM4ELMNA
SCHEMBL29047221 0.78 CA1 (0.40) CA1CA2CA9NPSR1CASP1
SCHEMBL24824843 0.78 CA1 (0.40) CA1CA2CA9NPSR1CASP1
SCHEMBL66618 0.78 CA1 (0.40) CA1CA2CA9NPSR1CASP1
SCHEMBL1411113 0.78 HTR7 (0.46) CA1CA2CA9NPSR1CASP1
SCHEMBL11594242 0.78 CA1 (0.40) CA1CA2CA9NPSR1CASP1
SCHEMBL1411032 0.78 HTR7 (0.50) CA1CA2CA9NPSR1CASP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0101207-B1 POLYAMIDE COMPOSITION UBE INDUSTRIES, LTD. (JP) 1987-04-22 EP claimed
JP-61225232-A None JP disclosed
JP-59109556-A None JP disclosed
EP-2562214-B1 THERMOPLASTIC POLYMER COMPOSITION, MOLDED ARTICLE FORMED FROM SAME, AND ELECTRIC WIRE MITSUI CHEMICALS INC (JP) 2017-04-05 EP disclosed
EP-2562214-A1 THERMOPLASTIC POLYMER COMPOSITION, MOLDED ARTICLE FORMED FROM SAME, AND ELECTRIC WIRE Mitsui Chemicals, Inc. (JP) 2013-02-27 EP disclosed
US-20130041080-A1 THERMOPLASTIC POLYMER COMPOSITION, AND ARTICLE AND ELECTRIC WIRE COMPRISING THE SAME MITSUI CHEMICALS, INC. 2013-02-14 US disclosed
US-20060051582-A1 Thermoplastic resin composition and molding consisting of the composition MITSUI CHEMICALS, INC (JP) 2006-03-09 US disclosed
US-20040039085-A1 Acid-methylol compound reaction products for flame resistance KASOWSHI ROBERT VALENTINE (US) 2004-02-26 US disclosed
WO-2001077217-A1 ACID-METHYLOL COMPOUND REACTION PRODUCTS FOR FLAME RESISTANCE KASOWSKI ROBERT VALENTINE (US) 2001-10-18 WO disclosed
EP-0309907-B1 Self-extinguishing moulding composition based on polyphenylene ether and polyamide BASF AG (DE) 1994-06-22 EP disclosed
EP-0309907-A2 Self-extinguishing moulding composition based on polyphenylene ether and polyamide BASF Aktiengesellschaft (DE) 1989-04-05 EP disclosed
US-4663372-A FIREPROOF POLYAMIDES UBE INDUSTRIES LTD. (JP) 1987-05-05 US disclosed
JP-S61225232-A POLYOLEFIN RESIN COMPOSITION ADEKA ARGUS CHEM CO LTD 1986-10-07 JP disclosed
US-4574154-A FIREPROOFING, POLYAMIDES UBE INDUSTRIES, LTD. (JP) 1986-03-04 US disclosed
JP-S59109556-A FLAME-RETARDANT POLYAMIDE COMPOSITION UBE IND LTD 1984-06-25 JP disclosed