SCHEMBL595016

SCHEMBL595016

C=Cc1cccc(CCc2cccc(C=C)c2)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
ALDH1A1 P00352 2/20 0.46
TSHR P16473 1/20 0.46
MAOA P21397 2/20 0.40
MAOB P27338 2/20 0.40
FAAH O00519 1/20 0.39
CYP19A1 P11511 1/20 0.39
OPRM1 P35372 2/20 0.38
OPRD1 P41143 2/20 0.38
OPRK1 P41145 2/20 0.38
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
CYP4F2 P78329 1/20 0.36
CYP4A11 Q02928 1/20 0.36
POLB P06746 1/20 0.35
TAAR1 Q96RJ0 5/20 0.34
HDAC8 Q9BY41 1/20 0.34
DRD2 P14416 1/20 0.34
DRD1 P21728 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375309 1.00 TP53 (0.52) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL1645656 0.98 TP53 (0.50) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL29619562 0.98 TP53 (0.50) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL29619625 0.96 TP53 (0.48) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL1646925 0.96 TP53 (0.48) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL10616284 0.94 ALDH1A1 (0.52) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL595303 0.92 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL1646708 0.92 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL29619561 0.92 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOA
SCHEMBL28980107 0.92 TP53 (0.45) TP53TDP1ALDH1A1TSHRMAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230265275-A1 Curable Compositions AGC Multi Material America, Inc. 2023-08-24 US claimed
US-11111383-B2 Resin composition and article made therefrom Elite Material Co., Ltd. (TW) 2021-09-07 US claimed
US-20210108075-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2021-04-15 US claimed
US-20260035559-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE MATERIAL CO LTD (TW) 2026-02-05 US disclosed
US-12534572-B2 Resin composition and article made therefrom Elite Material Co., Ltd. (TW) 2026-01-27 US disclosed
US-20260022232-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE MATERIAL CO LTD (TW) 2026-01-22 US disclosed
EP-4663669-A1 FLAME RETARDANT AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2025-12-17 EP disclosed
EP-4663646-A1 PHOSPHORUS COMPOUND, METHOD FOR SYNTHESIZING SAME, AND USE THEREFOR SHIKOKU CHEMICALS CORPORATION (JP) 2025-12-17 EP disclosed
EP-4632012-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, AND PRINTED SUBSTRATE Zeon Corporation (JP) 2025-10-15 EP disclosed
US-12409466-B2 Method and system for switching a dispensed fluid in a nanofabrication dispensing system CANON KABUSHIKI KAISHA (JP) 2025-09-09 US disclosed
WO-2025126839-A1 RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2025-06-19 WO disclosed
US-6930140-B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof HITACHI, LTD. (JP) 2005-08-16 US disclosed
US-20050064159-A1 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 2005-03-24 US disclosed
EP-1517595-A2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof HITACHI CHEMICAL CO., LTD. (JP) 2005-03-23 EP disclosed
US-20050020781-A1 Resin composition containing rubber component, and film and electronic part using the same HITACHI, LTD. (JP) 2005-01-27 US disclosed
US-6756441-B2 CROSSLINKING AGENT CONTAINING STYRENE GROUPS, FOR EXAMPLE 1,2-BIS(VINYLPHENYL)ETHANE (BVPE), A FILM FORMING POLYMER, AND A FILLER HITACHI, LTD. (JP) 2004-06-29 US disclosed
US-20040048965-A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof AMOU SATORU (JP) 2004-03-11 US disclosed
US-20040039127-A1 Electronic device using low dielectric loss tangent insulators for high frequency signals HITACHI, LTD. (JP) 2004-02-26 US disclosed
US-20040038611-A1 Low dielectric loss tangent films and wiring films HITACHI, LTD. (JP) 2004-02-26 US disclosed
US-20020161091-A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof HITACHI, LTD. (JP) 2002-10-31 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12534572-B2 Resin composition and article made therefrom GJB2, BPTF, PRPF6 TP53 2756/4885TDP1 3020/4885ALDH1A1 3980/4885
US-20260022232-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM P2RY10, P2RY13, P2RY11 TP53 2772/4885TDP1 1595/4885ALDH1A1 2601/4885
US-20260035559-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM PRPF6, CD79B, P2RY1 TP53 4266/4885TDP1 1806/4885ALDH1A1 1680/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.