SCHEMBL5954496

SCHEMBL5954496

CC(C)=CC1C=C(C)C(C)C(C(=O)O)C1C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.50
NPSR1 Q6W5P4 1/20 0.50
POLB P06746 2/20 0.35
LMNA P02545 1/20 0.35
CTDSP1 Q9GZU7 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2131868 0.89 ALDH1A1 (0.44) ALDH1A1NPSR1POLBLMNA
SCHEMBL3972795 0.88 ALDH1A1 (0.43) ALDH1A1NPSR1POLBLMNA
SCHEMBL10590786 0.61 POLB (0.37) POLBCTDSP1TDP1
SCHEMBL10590845 0.61 POLB (0.37) POLBCTDSP1TDP1
SCHEMBL12763458 0.60 POLB (0.40) ALDH1A1POLBLMNACTDSP1TDP1
SCHEMBL3229958 0.53 EDNRA (0.54) POLBCTDSP1TDP1
SCHEMBL25427070 0.52
SCHEMBL25287621 0.52
SCHEMBL8954735 0.52 POLB (0.53) ALDH1A1POLBLMNACTDSP1TDP1
SCHEMBL2967012 0.52 POLB (0.53) ALDH1A1POLBLMNACTDSP1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2013042019-A1 PROCESS FOR PREPARING MANUFACTURED PRODUCTS IN CONGLOMERATE OF GRANULATE OF STONE MATERIAL AND RESIN WITH ANHYDRIDES FROM RENEWABLE SOURCES TONCELLI LUCA (IT) 2013-03-28 WO claimed
US-6780674-B2 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-08-24 US claimed
US-20030155664-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-08-21 US claimed
US-20020077421-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-06-20 US claimed
EP-3419051-B1 CURABLE RESIN COMPOSITION AND FAN OUT TYPE WAFER LEVEL PACKAGE TAIYO HOLDINGS CO LTD (JP) 2026-04-08 EP disclosed
CN-108701657-B Curable resin composition and fan-out type wafer level package 太阳油墨制造株式会社 2022-05-13 CN disclosed
CN-109415493-B Sealing material for semiconductor 太阳油墨制造株式会社 2021-12-14 CN disclosed
US-8436031-B2 Transcription factor modulating compounds and methods of use thereof PARATEK PHARMACEUTICALS, INC. (US) 2013-05-07 US disclosed
WO-2013042019-A1 PROCESS FOR PREPARING MANUFACTURED PRODUCTS IN CONGLOMERATE OF GRANULATE OF STONE MATERIAL AND RESIN WITH ANHYDRIDES FROM RENEWABLE SOURCES TONCELLI LUCA (IT) 2013-03-28 WO disclosed
US-20090131401-A1 Transcription factor modulating compounds and methods of use thereof PARATEK PHARMACEUTICALS, INC. (US) 2009-05-21 US disclosed
US-20090131401-A1 Transcription factor modulating compounds and methods of use thereof PARATEK PHARMACEUTICALS, INC. (US) 2009-05-21 US disclosed
US-7405235-B2 Transcription factor modulating compounds and methods of use thereof PARATEK PHARMACEUTICALS, INC. (US) 2008-07-29 US disclosed
US-6780674-B2 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-08-24 US disclosed
US-20040054061-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-03-18 US disclosed
US-20030155664-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-08-21 US disclosed
US-6558812-B2 Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-06 US disclosed
US-6558812-B2 Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-06 US disclosed
US-20020077421-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-06-20 US disclosed
US-20020077421-A1 Liquid epoxy resin composition and semiconductor device SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-06-20 US disclosed
JP-2002097257-A LIQUID EPOXY-RESIN COMPOSITION AND APPARATUS FOR SEMICONDUCTOR SHIN ETSU CHEM CO LTD 2002-04-02 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090131401-A1 Transcription factor modulating compounds and methods of use thereof JUN, CREBBP, TFEB ALDH1A1 3948/4885NPSR1 4100/4885POLB 679/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.